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      GaN RF
      US$1.00 / Piece
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      What is High Performance 3300MHz-3800MHz RF Power GaN Transistor for Base Stations and Multi Carrier Applications

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      100 Pieces US$1.00 / Piece

      Sepcifications

      • Application Radio, RF Energy
      • Batch Number 2025
      • Certification CE, RoHS
      • Manufacturing Technology Discrete Device
      • Material GaN
      • Model GaN
      • Package SMD
      • Signal Processing Analog Digital Composite and Function
      • Type P-Type Semiconductor
      • Transport Package Reel/Tape
      • Specification other
      • Trademark Eversmart
      • Origin China
      • High Power 450W
      • Operation Temperature up to 150degree
      • Frequency Band 3300 MHz to 3800 MHz
      • Feature Wide Band

      Product Description

      Product Description 1. Product Introduction The HM1G3600-450N is a 450W RF GaN HEMT Transistor with first generation RF GaN technology from Eversmart, which is ideal for cellular base station applications at frequencies from 3300 MHz to 3800 MHz. 2. Features and benefits 1) High efficiency, high ...

      Learn More

      GaN RF Comparison
      Transaction Info
      Price US$1.00 / Piece US$10.00-100.00 / pc US$10.00-100.00 / pc US$10.00-100.00 / pc US$10.00-100.00 / pc
      Min Order 100 Pieces 25 pc 25 pc 25 pc 25 pc
      Payment Terms - T/T, PayPal T/T, PayPal T/T, PayPal T/T, PayPal
      Quality Control
      Product Certification CE, RoHS - - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Application: Radio, RF Energy;
      Batch Number: 2025;
      Manufacturing Technology: Discrete Device;
      Material: GaN;
      Model: GaN;
      Package: SMD;
      Signal Processing: Analog Digital Composite and Function;
      Type: P-Type Semiconductor;
      High Power: 450W;
      Operation Temperature: up to 150degree;
      Frequency Band: 3300 MHz to 3800 MHz;
      Feature: Wide Band;
      Application: Semi Standard;
      Material: Compound Semiconductor;
      Type: P-Type Semiconductor;
      Growth Method: CZ;
      Crystal Orientation: 100;
      Dopant: Boron;
      Resistivity: 1-100Ω;
      Frront Side: Polished;
      Edge: Polished;
      Diameter: 300±0.2mm;
      Thickness: 775±25μm;
      Application: Semi Standard;
      Material: Compound Semiconductor;
      Type: P-Type Semiconductor;
      Growth Method: CZ;
      Crystal Orientation: 100;
      Dopant: Boron;
      Resistivity: 1-100Ω;
      Frront Side: Polished;
      Edge: Polished;
      Diameter: 300±0.2mm;
      Thickness: 775±25μm;
      Application: Semi Standard;
      Material: Compound Semiconductor;
      Type: P-Type Semiconductor;
      Growth Method: CZ;
      Crystal Orientation: 100;
      Dopant: Boron;
      Resistivity: 1-100Ω;
      Frront Side: Polished;
      Edge: Polished;
      Diameter: 300±0.2mm;
      Thickness: 775±25μm;
      Application: Semi Standard;
      Material: Compound Semiconductor;
      Type: P-Type Semiconductor;
      Growth Method: CZ;
      Crystal Orientation: 100;
      Dopant: Boron;
      Resistivity: 1-100Ω;
      Frront Side: Polished;
      Edge: Polished;
      Diameter: 300±0.2mm;
      Thickness: 775±25μm;
      Supplier Name

      Shenzhen Eversmart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Fine Silicon Manufacturing(Shanghai)Ltd.

      Gold Member Audited Supplier

      Fine Silicon Manufacturing(Shanghai)Ltd.

      Gold Member Audited Supplier

      Fine Silicon Manufacturing(Shanghai)Ltd.

      Gold Member Audited Supplier

      Fine Silicon Manufacturing(Shanghai)Ltd.

      Gold Member Audited Supplier

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