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      GaN RF
      US$600.00 / Piece
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      What is High-Performance GaN RF Power Devices Sutable for Wireless Communication, EMC, Radio Positioning, Telemetry Application GaN Transistor

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      100 Pieces US$600.00 / Piece

      Sepcifications

      • Application Power Electronic Components, Radio, Television, Signal Jamming
      • Batch Number 2025
      • Certification CE, RoHS
      • Manufacturing Technology Discrete Device
      • Material GaN
      • Model GaN
      • Package SMD
      • Signal Processing Analog Digital Composite and Function
      • Type P-Type Semiconductor
      • Transport Package Reel/Tape
      • Specification other
      • Trademark Eversmart
      • Origin China
      • High Power up to 600W
      • Operation Temperature up to 150degree
      • Frequency Band Narrow Band or Wide Band

      Product Description

      Company Profile Shenzhen Eversmart Technology Co., Ltd. was founded in 2014, is a high-tech enterprise integrating research and development, production and sales. Since its inception, the company has taken security products as its main business, and since 2018, the R&D team has begun to layout the ...

      Learn More

      GaN RF Comparison
      Transaction Info
      Price US$600.00 / Piece US$6.00-11.00 / pc US$5.00-10.00 / pc US$5.00-10.00 / pc US$6.00-11.00 / pc
      Min Order 100 Pieces 100 pc 100 pc 100 pc 100 pc
      Payment Terms - T/T, PayPal T/T, PayPal T/T, PayPal T/T, PayPal
      Quality Control
      Product Certification CE, RoHS - - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Application: Power Electronic Components, Radio, Television, Signal Jamming;
      Batch Number: 2025;
      Manufacturing Technology: Discrete Device;
      Material: GaN;
      Model: GaN;
      Package: SMD;
      Signal Processing: Analog Digital Composite and Function;
      Type: P-Type Semiconductor;
      High Power: up to 600W;
      Operation Temperature: up to 150degree;
      Frequency Band: Narrow Band or Wide Band;
      Application: Semi Standard;
      Material: Compound Semiconductor;
      Type: P-Type Semiconductor;
      Growth Method: CZ;
      Crystal Orientation: 100;
      Dopant: Boron;
      Resistivity: 1-100Ω;
      Frront Side: Polished;
      Edge: Polished;
      Diameter: 200±0.2mm;
      Thickness: 725±25μm;
      Application: Semi Standard;
      Material: Compound Semiconductor;
      Type: P-Type Semiconductor;
      Growth Method: CZ;
      Crystal Orientation: 100;
      Dopant: Boron;
      Resistivity: 1-100Ω;
      Frront Side: Polished;
      Edge: Polished;
      Diameter: 50±0.2mm;
      Thickness: 280±25μm;
      Application: Semi Standard;
      Material: Compound Semiconductor;
      Type: P-Type Semiconductor;
      Growth Method: CZ;
      Crystal Orientation: 100;
      Dopant: Boron;
      Resistivity: 1-100Ω;
      Frront Side: Polished;
      Edge: Polished;
      Diameter: 100±0.2mm;
      Thickness: 400±25μm;
      Application: Semi Standard;
      Material: Compound Semiconductor;
      Type: P-Type Semiconductor;
      Growth Method: CZ;
      Crystal Orientation: 100;
      Dopant: Boron;
      Resistivity: 1-100Ω;
      Frront Side: Polished;
      Edge: Polished;
      Diameter: 200±0.2mm;
      Thickness: 725±25μm;
      Supplier Name

      Shenzhen Eversmart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Fine Silicon Manufacturing(Shanghai)Ltd.

      Gold Member Audited Supplier

      Fine Silicon Manufacturing(Shanghai)Ltd.

      Gold Member Audited Supplier

      Fine Silicon Manufacturing(Shanghai)Ltd.

      Gold Member Audited Supplier

      Fine Silicon Manufacturing(Shanghai)Ltd.

      Gold Member Audited Supplier