PCB

US$0.01-10.00 / piece

Multilayer PCB Board with BGA, Immerion Gold, HDI PCB and PCB Assembly pictures & photos

Recommend for you
What is Security PCB 12 Layer Impedance IC Test Board Enig 2oz China Factory
What is Lead Free Hal PCB PCBA Air Conditioner with High Quality in China
What is Immersion Gold Multilayer PCB Customized Electronic Printed Circuit Board

What is Multilayer PCB Board with BGA, Immerion Gold, HDI PCB and PCB Assembly

Name: Multilayer PCB Board with BGA, Immerion Gold, HDI PCB and PCB Assembly
Uploaded: 2025-12-21T08:10:11+08:00
Description: ABIS CIRCUITS CO., LTD is a professional PCB manufacturing which is focus on double side, Multilayer and HDI pcb mass production. The company was established on 2006, We have two factories together(au

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 piece US$0.01-10.00 / piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification 128*148mm
Trademark ABIS CIRCUITS CO., LTD
Origin Shenzhen, China
Layers 6 Layers
Raw Material Fr4, Tg150
Solder Mask Green
Legend White
Surface Finish Immersion Gold 2u"
Mini Hole 0.1mm
Mini Line Width 0.1mm
Mini Line Trace 0.1mm

Product Description

ABIS CIRCUITS CO., LTD is a professional PCB manufacturing which is focus on double side, Multilayer and HDI pcb mass production. The company was established on 2006, We have two factories together(audited by UL,ISO9001/14001,SGS,RoHS report),Now we dedicated to LED PCB and offer OEM/ODM service for ...

Learn More

Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Main Products Yes
Address Room 4113-4116, a Building, Hangcheng Intelligence Security Technology Park, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CFR, CIF, DAP, FCA
Terms of Payment LC, T/T, PayPal, Western Union
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

	Multilayer PCB Board with BGA, Immerion Gold, HDI PCB and PCB Assembly Contact Now	Quick View PCBA Service Custom PCB for LED Lights - Thermal Management Solution with Heavy Copper Quick Turn Prototype Contact Now	Quick View PCB Circuit Board Manufacturer. Fr4 Fiberglass Boards, Single-Sided and Double-Sided Boards, LED Main Boards. PCB Circuit Board Copying, Production and Processi Contact Now	Thermal Management Copper PCB for Quick Turn LED Light Prototypes Contact Now	Thermal Management Solution with Heavy Copper PCB for LED Lighting Applications Contact Now

Transaction Info
	Multilayer PCB Board with BGA, Immerion Gold, HDI PCB and PCB Assembly Contact Now	Quick View PCBA Service Custom PCB for LED Lights - Thermal Management Solution with Heavy Copper Quick Turn Prototype Contact Now	Quick View PCB Circuit Board Manufacturer. Fr4 Fiberglass Boards, Single-Sided and Double-Sided Boards, LED Main Boards. PCB Circuit Board Copying, Production and Processi Contact Now	Thermal Management Copper PCB for Quick Turn LED Light Prototypes Contact Now	Thermal Management Solution with Heavy Copper PCB for LED Lighting Applications Contact Now
Price	US$0.01-10.00 / piece	US$0.80-2.60 / Piece	US$0.01-0.09 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece
Min Order	1 piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union	T/T, Western Union	T/T, LC, D/P, PayPal, Western Union, Small-amount payment	T/T, Western Union	T/T, Western Union
Quality Control
Management System Certification	-	ISO14001, ISO9001:2015, ISO45001:2018, Others	-	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Southeast Asia/ Mideast, Domestic	East Asia(Japan/ South Korea), Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand, ODM	ODM, OEM	Own Brand, ODM	Own Brand, ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Layers: 6 Layers; Raw Material: Fr4, Tg150; Solder Mask: Green; Legend: White; Surface Finish: Immersion Gold 2u"; Mini Hole: 0.1mm; Mini Line Width: 0.1mm; Mini Line Trace: 0.1mm;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;
Supplier Name	Abis Circuits Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Shenzhen Hemeilin Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.
Select All

Contact Now

Hot Search