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      Thermal Management Solution with Heavy Copper PCB for LED Lighting Applications

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.80-2.60 / Piece

      Sepcifications

      • Type Combining Rigid Circuit Board
      • Dielectric MCPCB\Fr4\Bt
      • Application New Energy Vehicle Electronic Control Board
      • Flame Retardant Properties Customized
      • Mechanical Rigid Rigid
      • Processing Technology Delay Pressure Foil
      • Base Material Double-Sided/Multilayer Aluminum/Copper
      • Insulation Materials Customized
      • Brand Hongyu
      • Transport Package Sea/Land/Air Freight
      • Specification customized
      • Trademark hongyu
      • Origin Jiangxi, China
      • Board Thickness 1.6mm
      • Metal Core PCB T2 High Conductivity Copper(1.6mm)
      • Thermal Conductivity 398W/M-K+Non Thermoelectric Separation Ar
      • Copper Foil 70μm
      • Tg 150°C

      Product Description

      Specification NO. Project Conventional process capability Extreme process capability advantage 1 layer 1-10 10 2 Product Type MCPCB\FR4\BT MCPCB\FR4\BT * 3 Surface Treatment HASL/OSP/ENIG/Immersion Silver (IAg)/ Immersion Tin (Sn)/Gold Plating HASL/OSP/ENIG/Immersion Silver (IAg)/ Immersion Tin ...

      Learn More

      Heavy Copper Solution Comparison
      Transaction Info
      Price US$0.80-2.60 / Piece US$1.98-5.20 / Piece US$1.98-5.20 / Piece US$0.90-2.60 / Piece US$5.00 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification - RoHS/ISO9001/Ts16949/ISO14001/ISO13485 RoHS/ISO9001/Ts16949/ISO14001/ISO13485 - ISO9001/Ts16949/RoHS/Ts16949
      Management System Certification ISO14001, ISO9001:2015, ISO45001:2018, Others - - - -
      Trade Capacity
      Export Markets Southeast Asia/ Mideast, Domestic North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Application: New Energy Vehicle Electronic Control Board;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Brand: Hongyu;
      Board Thickness: 1.6mm;
      Metal Core PCB: T2 High Conductivity Copper(1.6mm);
      Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar;
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Mustar;
      Copper Thickness: 1-12 Oz;
      Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
      Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
      Minimum Line Spacing: 0.015mm;
      Minimum Line Width Spacing: 0.015mm;
      Testing Service: Ict, Function Test, X-ray, Aoi;
      MOQ: 1PCS;
      Layers: 1-64;
      Warranty: 2 Years;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Mustar;
      Copper Thickness: 1-12 Oz;
      Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
      Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
      Minimum Line Spacing: 0.015mm;
      Minimum Line Width Spacing: 0.015mm;
      Testing Service: Ict, Function Test, X-ray, Aoi;
      MOQ: 1PCS;
      Layers: 1-64;
      Warranty: 2 Years;
      Type: 94V-0 Multilayer PCB;
      Dielectric: FR-4;
      Material: Customized;
      Application: All;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid, Fexible, Rigid and Fexible;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper, FPC , Ceramic, Aluminum-Based, High Freque;
      Insulation Materials: Organic Resin;
      Service: PCB+Assembly+Components;
      Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
      Testing Service: Electrical Testing,Flying Probe Tester,Functional;
      Min. Hole Size: 0.15mm;
      Min. Line Spacing: 0.075---0.09mm;
      Surface Finishing: Asl\OSP\Immersion Gold;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Complex;
      Application: Medical Instruments;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Mu Star;
      Color: Customized;
      Testing Service: Aoi/ X-ray/ Fai;
      Board Thickness: 1.6mm;
      Number of Layers: 1-58 Layers;
      Supplier Name

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      JS Technology Co., Ltd.

      Diamond Member Audited Supplier

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

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