| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Kingboard;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
Enig Thickness: 1-3u'';
Board Thickness: 0.2-6mm;
Hard Gold Thickness: 1-50u'';
Layers: 1-20layers;
Copper Thickness: 0.5-8oz;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Automotive Radar and Sensors;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Hydrocarbon Resin;
Brand: Rogers;
Tihickness: 8mil, 12mil, 20mil, 32mil and 60mil;
Soldermask Color: Blcak, Blue, Yellow, Red, Green...;
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Color: Blue;
Type: Blue;
Function: Automatic Control;
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Type: Rigid Circuit Board;
Dielectric: Diclad 870;
Material: Diclad 870 (Ceramic/PTFE Composite);
Application: Microwave and RF Systems;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Lead-Free Hot Air Solder Leveling (HASL);
Base Material: Diclad 870 (Ceramic/PTFE Composite);
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Contour/Cutting: Routing;
Via: Plated Through Hole(Pth), Minimum Size 0.9mm.;
Flamibility Rating: 94V-0;
Test: 100% Electrical Test Prior Shipment;
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Type: Rigid Circuit Board;
Dielectric: F4bm250 (PTFE Fiberglass);
Material: Wangling F4bm250, a PTFE Fiberglass Composite;
Application: Radar;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Bare Copper (No Surface Finish);
Base Material: PTFE-Based, with a Low Dielectric Constant.;
Insulation Materials: PTFE-Based Composites;
Brand: Wangling;
Board Types: Rigid PCB;
Test: 100% Electrical Test Prior Shipment;
Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
Service Area: Worldwide, Globally;
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