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      撸啊撸激情久久,亚洲AV成人无码网天堂,久久久久久久,性爱综合网,91人人干,五月综合色,国产91无码精品综合,日日夜夜人人

      Single Multilayer 18 Layer Ceramic PCB Board Manufacturer

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.10 / Piece

      Sepcifications

      • Structure Double-Sided Rigid PCB
      • Dielectric FR-4
      • Material Polyester Glass Fiber Mat Laminate
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Production Process Subtractive Process
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Transport Package Vacuum Package
      • Specification Normal
      • Trademark XJYPCB
      • Origin China
      • Surface Finishing HASL
      • Copper Thickness 1oz
      • Board Thickness 1.6mm
      • Min. Hole Size 0.25mm
      • Min. Line Wigth 0.15mm
      • Min. Line Spacing 0.15mm
      • Color Green
      • Size 66*56mm
      • Certificate RoHS, UL, SGS, Ect
      • Package Vacuum

      Product Description

      WELCOME TO XJYPCB Place of Origin: Guangdong China (Mainland) Brand Name: XJY Base Material: FR4 Copper Thickness: 25um Min. Hole Size: 0.15mm Min. Line Width: 0.20mm Surface Finishing: LF-HAL Layer: Double side Soldermask: Green ...

      Learn More

      Printed Circuit Board Comparison
      Transaction Info
      Price US$0.10 / Piece US$0.01-50.00 / Piece US$0.01-100.00 / Piece US$0.01-50.00 / Piece US$0.01-100.00 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
      Quality Control
      Product Certification RoHS, UL, SGS, Ect - - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Double-Sided Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Surface Finishing: HASL;
      Copper Thickness: 1oz;
      Board Thickness: 1.6mm;
      Min. Hole Size: 0.25mm;
      Min. Line Wigth: 0.15mm;
      Min. Line Spacing: 0.15mm;
      Color: Green;
      Size: 66*56mm;
      Package: Vacuum;
      Structure: Flush Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Semi-Additive Process;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Abis;
      Layer: 1-40 Layers;
      Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
      Board Thickness: 0.20mm-8.00mm;
      Board Outline Tolerance: +0.10mm;
      Impedance Control Tolerance: +/-10%;
      Minimum Line/Space: 0.075mm;
      Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Aerospace;
      Flame Retardant Properties: V2;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Abis;
      Layer Counts: 1-30 Layers;
      Board Thickness: 0.20mm-8.00mm;
      Maximum Size: 600mmx1200mm;
      Insulation Layer Thickness: 0.075mm--5.00mm;
      Minimum Line: 0.075mm;
      Minimum Space: 0.075mm;
      out Layer Copper Thickness: 18um--350um;
      Inner Layer Copper Thickness: 17um--175um;
      Diameter Tolerance(Mechanical): 0.05mm;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Semi-Additive Process;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Abis;
      Layer: 1-40 Layers;
      Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
      Board Thickness: 0.20mm-8.00mm;
      Board Outline Tolerance: +0.10mm;
      Impedance Control Tolerance: +/-10%;
      Surface Finish/Treatment: HASL,Enig,Chem,Tin,Flash Gold, OSP, Gold Finger;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Aerospace;
      Flame Retardant Properties: V2;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Abis;
      Layer Counts: 1-30 Layers;
      Board Thickness: 0.20mm-8.00mm;
      Maximum Size: 600mmx1200mm;
      Insulation Layer Thickness: 0.075mm--5.00mm;
      Minimum Line: 0.075mm;
      Minimum Space: 0.075mm;
      out Layer Copper Thickness: 18um--350um;
      Inner Layer Copper Thickness: 17um--175um;
      Diameter Tolerance(Mechanical): 0.05mm;
      Supplier Name

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

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