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Professional High-Quality Customize PCB&PCBA Design & Manufacture for Electronic Projects

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Price

Min. Order Reference FOB Price

1 Piece US$0.01-100.00 / Piece

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Aerospace
Flame Retardant Properties V2
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Organic Resin
Brand Abis
Transport Package Vacuum Packing
Specification 70*30
Trademark Abis
Origin China
Layer Counts 1-30 Layers
Board Thickness 0.20mm-8.00mm
Maximum Size 600mmx1200mm
Insulation Layer Thickness 0.075mm--5.00mm
Minimum Line 0.075mm
Minimum Space 0.075mm
out Layer Copper Thickness 18um--350um
Inner Layer Copper Thickness 17um--175um
Diameter Tolerance(Mechanical) 0.05mm

Product Description

Professional High-Quality Customize PCB&PCBA Design &Manufacture for Electronic Projects Technical &Capability Item Production Capacity Layer Counts 1-20 layers Material FR-4,Cu base,High TG FR-4,PTFE,Rogers,TEFLON etc. Board thickness 0.20mm-8.00mm Maximum Size 600mmX1200mm Board ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Main Products Yes
Address Room 4113-4116, a Building, Hangcheng Intelligence Security Technology Park, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CFR, CIF, DAP, FCA
Terms of Payment LC, T/T, PayPal, Western Union
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PWB Comparison

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Transaction Info
	Professional High-Quality Customize PCB&PCBA Design & Manufacture for Electronic Projects Contact Now	Quick View Smart Phone Display PCB Board Manufacture Contact Now	Quick View Calculator Printed Circuit Board Manufacture Contact Now	Quick View High Quality Calculator PCB Board Contact Now	Quick View WiFi Printed Circuit Board Manufacture Contact Now
Price	US$0.01-100.00 / Piece	US$0.10 / Piece	US$0.10 / Piece	US$0.10 / Piece	US$0.10 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram	LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram	LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram	LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification	-	RoHS, UL, SGS, Ect	RoHS, UL, SGS, Ect	RoHS, UL, SGS, Ect	RoHS, UL, SGS, Ect
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Aerospace; Flame Retardant Properties: V2; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Abis; Layer Counts: 1-30 Layers; Board Thickness: 0.20mm-8.00mm; Maximum Size: 600mmx1200mm; Insulation Layer Thickness: 0.075mm--5.00mm; Minimum Line: 0.075mm; Minimum Space: 0.075mm; out Layer Copper Thickness: 18um--350um; Inner Layer Copper Thickness: 17um--175um; Diameter Tolerance(Mechanical): 0.05mm;	Structure: Metal Base Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: Lf-Hal; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: Green; Size: 3545mm;* Package: Vacuum;	Structure: Metal Base Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: Lf-Hal; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: Green; Size: 3545mm;* Package: Vacuum;	Structure: Metal Base Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: Lf-Hal; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: Green; Size: 3545mm;* Package: Vacuum;	Structure: Metal Base Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: Lf-Hal; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: Green; Size: 3545mm;* Package: Vacuum;
Supplier Name	Abis Circuits Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.
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