Chip Die Bonding System for Lab Using dB100

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Price

Min. Order Reference FOB Price

1 Piece US$90,500.00-119,000.00 / Piece

Sepcifications

After-sales Service Online and Video Service
Condition New
Speed Medium Speed
Precision High Precision
Certification CE
Warranty 12 Months
Automatic Grade Semiautomatic
Type Medium-speed Chip Mounter
Transport Package Polywood Case
Specification 800 * 750 * 630mm
Trademark TERMWAY
Origin Beijing, China
Max. Chip Size Smaller 20mm X20mm(50*50mm Optional)
Min. Chip Size 0.2*0.2mm
Mounting Precision ±3um 3δ
Feeding Mode 2 Inch Waffle Box*2
Substrate Size 150*150mm
X Y Z Axis Motion System Roller Screw + Servo Motor
X Y Axis Resolution 0.1um
Power Supply 220V, 50Hz
Net Weight 150kg

Product Description

Chip die bonding system for lab using DB100 DB100 is a manual-semi-automatic micro assembly placement system. The whole machine uses a marble motion platform to ensure that the entire motion accuracy reaches the sub-micron level. It comes with a laser height measurement system, which can ...

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Termway (Beijing) Precision Technology Co., Ltd.

Diamond Member Since 2010

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB Assembly, Pick&Place Machine, Reflow Oven/Wave Machine, Screen Printer, Dispenser
Year of Establishment 2012-07-31
Number of Employees 28
Address 12i Factory Building, No 15, Jingsheng South 4th Street, Jinqiao Science and Technology Industrial Base, Zhongguancun High-Tech Park, Tongzhou District, Beijing

Die Bonder Comparison

	Chip Die Bonding System for Lab Using dB100 Contact Now	Quick View Die Bonder and Die Bonding Machine for COB Box to Tec Mems Contact Now	Quick View Advanced Automatic Clip Chip Die Bonder for Semiconductor Assembly Contact Now	Quick View High Precision Automatic Die Bonding Machine for Semiconductors Contact Now	Quick View High Precision Automatic Die Bonder for COB and Mems Applications Contact Now

Transaction Info
	Chip Die Bonding System for Lab Using dB100 Contact Now	Quick View Die Bonder and Die Bonding Machine for COB Box to Tec Mems Contact Now	Quick View Advanced Automatic Clip Chip Die Bonder for Semiconductor Assembly Contact Now	Quick View High Precision Automatic Die Bonding Machine for Semiconductors Contact Now	Quick View High Precision Automatic Die Bonder for COB and Mems Applications Contact Now
Price	US$90,500.00-119,000.00 / Piece	US$100,000.00-1,000,000.00 / Piece	US$10,000.00-100,000.00 / Piece	US$70,000.00-120,000.00 / Piece	US$100,000.00-1,000,000.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Product Certification	CE	ISO	ISO, CE	RoHS, ISO, CE	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, Europe, East Asia(Japan/ South Korea)	Europe	Europe	Europe	Europe
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Product Attributes
Specification	After-sales Service: Online and Video Service; Condition: New; Speed: Medium Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Semiautomatic; Type: Medium-speed Chip Mounter; Max. Chip Size: Smaller 20mm X20mm(5050mm Optional);* Min. Chip Size: 0.20.2mm;* Mounting Precision: ±3um 3δ; Feeding Mode: 2 Inch Waffle Box2;* Substrate Size: 150150mm;* X Y Z Axis Motion System: Roller Screw + Servo Motor; X Y Axis Resolution: 0.1um; Power Supply: 220V, 50Hz; Net Weight: 150kg;	After-sales Service: Yes; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Key Applications: Power Devices, Advanced Packaging; Placement Accuracy: ±10–25µm; Throughput: Pplication-Dependent; Dispensing: Dual-System; Theta Accuracy: ±1° @3σ; Force & Process Control: Stable Force Control; Model Type: Da801/Da1201; Dual Dispensing Options: Dipping (Epoxy) Jetting (Non-Contact);	After-sales Service: Yes; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Placement Accuracy: +/-50um@3σ; Theta Accuracy: ±3° @3σ; Throughput: up to 20 Clips/Cycle; Bonding Functions: Prebond & Postbond; Inspection Capabilities: Solder Patch & Paste Inspection; Drive System: High-Precision Linear Die Bond Head; Material Handling: Clip Punching System; Application: Power Semiconductor Packaging;	After-sales Service: Yes; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Product Name: COB Smart Die Bonding Machine; High Placement Accuracy: +/- 50um @3σ; Theta Placement Accuracy: +/- 3° @3σ; High Throughput: up to 20 Clips / Cycle; Automation Level: Fully Automatic Loading & Unloading; Target Products: SMD, 1W & High-Power COB Surface Light Sources; Pin Processing Capability: Ultra-Long Pin (65ms); Minimum Chip Size: 5 Mil (127 Micrometers);	After-sales Service: Yes; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter;
Supplier Name	Termway (Beijing) Precision Technology Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.
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