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High Precision Bonder

US$100,000.00-1,000,000.00 / Piece

High Precision Automatic Die Bonder for COB and Mems Applications pictures & photos

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What is High Precision Automatic Die Bonder for COB and Mems Applications

Name: High Precision Automatic Die Bonder for COB and Mems Applications
Uploaded: 2025-12-23T22:20:05+08:00
Description: Product Description Precision High Precision Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Transport Package Customized or W

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-1,000,000.00 / Piece

Sepcifications

After-sales Service Yes
Condition New
Speed High Speed
Precision High Precision
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Air Freight
Trademark Himalaya
Origin China

Product Description

Product Description Precision High Precision Condition New Certification ISO Warranty 12 Months Automatic Grade Automatic Installation Vertical Driven Type Electric Transport Package Customized or Wooden Box Packaging Trademark Himalaya Production Capacity 1 Automatic loading ...

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Jiangsu Himalaya Semiconductor Co., Ltd.

Gold Member Since 2023

Audited Supplier

Main Products Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, ...
Year of Establishment 2019-09-12
Repeat Buyers Choice 80%~100%
Address Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital 100,000,000 RMB
Main Markets Europe

High Precision Bonder Comparison

	High Precision Automatic Die Bonder for COB and Mems Applications Contact Now	Quick View Kohyong 8030-2 SMT 3D Online Fully Automatic Solder Paste Inspection Equipment Contact Now	Quick View High Precision SMD Juki Lx-8 Automated Pick and Place Machinery Contact Now	Quick View High Quality SMT Samsung Hanwha Xm520 Mf Chip Mounter Machine for SMT PCB Assembly Line LED Contact Now	Quick View FUJI Pick and Place Machine Chip Mounter FUJI Xpf-L SMT Machine High Speed Good Quality Electronics Production Machinery Contact Now

Transaction Info
	High Precision Automatic Die Bonder for COB and Mems Applications Contact Now	Quick View Kohyong 8030-2 SMT 3D Online Fully Automatic Solder Paste Inspection Equipment Contact Now	Quick View High Precision SMD Juki Lx-8 Automated Pick and Place Machinery Contact Now	Quick View High Quality SMT Samsung Hanwha Xm520 Mf Chip Mounter Machine for SMT PCB Assembly Line LED Contact Now	Quick View FUJI Pick and Place Machine Chip Mounter FUJI Xpf-L SMT Machine High Speed Good Quality Electronics Production Machinery Contact Now
Price	US$100,000.00-1,000,000.00 / Piece	US$106,000.00 / Piece	US$120,000.00 / Piece	US$45,000.00-70,000.00 / Piece	US$56,000.00-85,000.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union	T/T, D/P, PayPal, Western Union, LC	T/T, D/P, PayPal, Western Union, LC	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	-	CE	CE	CE	CCC, CE
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	-	-	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification	After-sales Service: Yes; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter;	After-sales Service: Support; Condition: New; Speed: High Speed; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Max.Inspection Height: 450um; Dimension W X D X H: 800X907X1, 512mm; Camera Resolution: 10/25um; Camera: 4m;	After-sales Service: Support; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Maximum: 5mm; Minimum: 0201/03015; Component Height: 3mm/25mm; Lx-8: High;	Condition: New; Speed: High Speed; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Product Name: Samsung Pick and Place Machine; Model: Decan Xm520 Mf; Application: SMT Assembly Production Line; Usage: SMT, SMD, PCB Production Line; Applicable Components: 0402~5050; Alignment: Fly Camera, Fix Camera; Placement Speed: 56,000 Cph; Power Supply: AC220V 50Hz/AC110V 60Hz; Applicable Parts: 0402 ~ 55mm(H 15mm); Specification Size: L 1,430 X D 1,740 X H 1,995;	Condition: New and Used; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Product Name: FUJI Pick and Place Machine; Model: Xpf-L; Power: 110V/220; Warranty Period: 1 Year; Quality: 100% Tested; Customized: Accept; PCB Size: Max 457X356mm, Min 50X50mm;
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