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      Electronic Component
      US$2.00 / Piece
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      What is Wemos D1 Esp8266 Wi-Fi Board 80-160MHz Iot D1-Uno Development Board Module

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      10 Pieces US$2.00 / Piece

      Sepcifications

      • Type Module Board
      • Dielectric FR-4
      • Material Customised
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Model PCB
      • Transport Package Standard
      • Specification Standard
      • Trademark Original
      • Origin Original
      • Quality High
      • Lead Time 0-10days
      • Microcontroller Esp-8266 32-Bit
      • Clock Speed 80MHz and up to 160MHz
      • USB Converter CH340g
      • Operating Voltage 3.3V
      • Flash Memory 4MB
      • Digital I/O 11
      • Communications I2c, Serial, Spi
      • WiFi Built-in

      Product Description

      WEMOS D1 ESP8266 Wi-Fi Board 80-160MHz IoT D1-UNO development board module Provide bom serice/Contact for more component TYPE DESCRIPTION Category Module board Product Status Active Type Factory manufacturer Q1: What services do you offer? We provide turnkey solutions including R&D, PCB ...

      Learn More

      Electronic Component Comparison
      Transaction Info
      Price US$2.00 / Piece US$0.90-99.99 / PCS US$0.90-99.99 / PCS US$0.90-99.99 / PCS US$0.90-99.99 / PCS
      Min Order 10 Pieces 1 PCS 1 PCS 1 PCS 1 PCS
      Payment Terms LC, T/T Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Product Attributes
      Specification
      Type: Module Board;
      Dielectric: FR-4;
      Material: Customised;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Model: PCB;
      Quality: High;
      Lead Time: 0-10days;
      Microcontroller: Esp-8266 32-Bit;
      Clock Speed: 80MHz and up to 160MHz;
      USB Converter: CH340g;
      Operating Voltage: 3.3V;
      Flash Memory: 4MB;
      Digital I/O: 11;
      Communications: I2c, Serial, Spi;
      WiFi: Built-in;
      Type: Rigid Circuit Board;
      Dielectric: Rt/Duroid 6035HTC;
      Material: Ceramic-Filled PTFE Composite;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Brand: Rogers;
      Surface Finish: Bare Copper;
      Board Thickness: 0.6mm(Finished);
      Layer Count: 2-Layer;
      Solder Mask: None;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Organic-Ceramic Woven Fiberglass Reinforced Lamina;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Brand: Taconic;
      Thickness: 31mil;
      Layer Count: 2-Layer;
      Application: Passive Components;
      Surface Finish: Immersion Gold;
      Type: Rigid Circuit Board;
      Dielectric: RO4003c;
      Material: Woven Glass-Reinforced Hydrocarbon/Ceramic Materia;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Brand: Rogers;
      Surface Finish: Immersion Gold;
      Board Thickness: 1.6mm (Finished);
      Layer Count: 2-Layer;
      Solder Mask: None;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Ceramic, Hydrocarbon, Thermoset Polymer Composites;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Brand: Rogers;
      Thickness: 20mil 50mil 75mil;
      Layer Count: Double Layer, Multilayer, Hybrid PCB;
      Application: Stripline and Microstrip;
      Surface Finish: Bare Copper, HASL, Enig, OSP, Immersion Tin, etc.;
      Supplier Name

      ShenZhen Nova Semiconductor Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

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