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      Amplifier PCB Board
      US$0.90-99.99 / PCS
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      What is Rogers RO4003c Amplifier PCB Board of Shenzhen Electronics Custom PCB

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 PCS US$99.99

      100+ PCS US$0.90

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric RO4003c
      • Material Woven Glass-Reinforced Hydrocarbon/Ceramic Materia
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Model PCB
      • Brand Rogers
      • Transport Package Kk Paper, 3-Layer Wrinkle
      • Specification 42.56mm x 63.2mm (± 0.15mm)
      • Trademark Bicheng
      • Origin Shenzhen China
      • Surface Finish Immersion Gold
      • Board Thickness 1.6mm (Finished)
      • Layer Count 2-Layer
      • Solder Mask None

      Product Description

      Rogers RO4003C Double-Layer PCB 1.6mm Thickness - High-Frequency RF Board for Automotive Radar &Cellular Antennas (All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.) 1.Overview of RO4003C Double-Layer PCB Rogers RO4003C PCBs are ...

      Learn More

      Amplifier PCB Board Comparison
      Transaction Info
      Price US$0.90-99.99 / PCS US$0.30-10.00 / Piece US$0.26-0.54 / Piece US$0.01-0.11 / Piece Negotiable
      Min Order 1 PCS 1 Piece 1 Piece 1 Piece 100 Pieces
      Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, LC
      Quality Control
      Product Certification - - - ISO/CQC/IATF/UL/RoHS -
      Management System Certification - - - - ISO9001:2015, ISO45001:2018, ISO14001
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic South America, Europe, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model ODM, OEM ODM, OEM - ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: RO4003c;
      Material: Woven Glass-Reinforced Hydrocarbon/Ceramic Materia;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Brand: Rogers;
      Surface Finish: Immersion Gold;
      Board Thickness: 1.6mm (Finished);
      Layer Count: 2-Layer;
      Solder Mask: None;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Complex;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Model: FR-4;
      Brand: New Chip;
      PCBA-Testing: X-ray, Aoi;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Model: FR-4;
      Brand: UC;
      Board Layer: 1-24;
      Board Thickness: 0.4-3.2 mm;
      Soldermask Color: Green/White/Black/Blue/Red;
      Surface Finish: Immersion Gold/HASL Lead Free/OPS/ Immersion Silve;
      Lead Time: 5+ Working Days;
      Fast Turn: 2+ Working Days;
      Ipc Standards: Ipc Class II;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Flame Retardant Properties: 94 V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Layer: 1 to 20;
      Mini Board Size: 8*8mm;
      Max Board Size: 650*610mm;
      Board Thickness: 0.3mm~3.5mm;
      Finished Inner Copper Thickness: H/H0z-4/40z;
      Finished Outer Copper Thickness: H/H0z-5/50z;
      Min Hole Size: 0.2mm;
      Heat Conductivity: 1.5 to 3W;
      Surface Finishing: OSP, HASL, Gold Plating, Enig, Immersion Gold;
      Warranty: 1 Year;
      Brand: Smart Power;
      Supplier Name

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Ucreate PCB Co., Ltd.

      Diamond Member Audited Supplier

      Jian Unice Pcb Technique Co., Ltd

      Gold Member Audited Supplier

      Hangzhou Zhouju Electronic Technological Co., Ltd.

      Diamond Member Audited Supplier

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