PCBA Factory Electronic Circuit Board Assembly PCB Assembly Service ODM PCB Manufacturer

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Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$10.00

100-999 Pieces US$5.00

1,000+ Pieces US$0.30

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Complex
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Organic Resin
Model FR-4
Brand New Chip
Transport Package Anti-Static Bag, Bubble Pack, Carton Box
Trademark New Chip
Origin China
PCBA-Testing X-ray, Aoi

Product Description

Product Description What we offer: Quote Requirement: Gerber file of the bare PCB board BOM (Bill of material) for assembly To short the lead time, please kindly advise us if there is any acceptable components substitution (for PCB assembly). Testing Guide &Test Fixtures if necessary ...

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Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Year of Establishment 2022-05-11
Number of Employees 10
Address A904, plant 3, Longgang Tian'an Digital Innovation Park, No. 449, Huangge North Road, huanggekeng community, Longcheng street, Longgang District, Shenzhen

PCBA Comparison

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Transaction Info
	PCBA Factory Electronic Circuit Board Assembly PCB Assembly Service ODM PCB Manufacturer Contact Now	Specialized PCBA Assembly PCB and Soldering Services for Medical Devices with Reliability PCBA Manufacturing Contact Now	Local Assembly Basingstoke PCB for UK Market with Rapid Delivery Circuit-Board PCBA Manufacturing Contact Now	Main PCB Assembly Services for Consumer Electronics with Advanced Capabilities Electronic Control Board Contact Now	Thorough PCB Assembly PCB and Testing for Aerospace Systems with High Standards PCBA 60W Contact Now
Price	US$0.30-10.00 / Piece	US$0.10-1.00 / Piece	US$0.10-1.00 / Piece	US$0.10-1.00 / Piece	US$0.10-1.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, PayPal, Western Union	T/T, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	-	-	-	-
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Complex; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Model: FR-4; Brand: New Chip; PCBA-Testing: X-ray, Aoi;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Immersion Gold; Base Material: Fr4; Insulation Materials: Epoxy Resin; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;
Supplier Name	Shenzhen New Chip international Ltd	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited	Shenzhen Hemeixin Electronic Co., Limited
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