Android Development Board

US$64.90-69.90 / Piece

Rk3399 Industrial Embedded Development Board Dual Camera Screen Android System pictures & photos

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What is Rk3399 Industrial Embedded Development Board Dual Camera Screen Android System

Name: Rk3399 Industrial Embedded Development Board Dual Camera Screen Android System
Uploaded: 2025-12-20T14:53:25+08:00
Description: Product Description Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board System CPU Rockchip RK3399,ARM Dual Core A72, 4Core A53,UP to 1.8GHz GPU 4Core Mali-T860

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Price

Min. Order Reference FOB Price

2 Pieces US$64.90-69.90 / Piece

Sepcifications

Integrated Graphics Integrated Graphics
Main Chipset Rockchip
Maximum Memory Capacity 8G
Structure ATX
Memory DDR2
SATA Interface SATA3.0
CPU Socket LGA 775
Printed Circuit Board Six Layer
Main Board Structure Integrated
Audio Effects HiFi
Transport Package Inner-Plastic Bag; Outer-Standard Carton Box
Specification Customized
Trademark customized
Origin Shenzhen, China
Name PCBA Assembly Manufacturing
Inspection 100% IQC, Ipqc, Fqc, QA, Ict
Advantages PCB Design/Assembly, PCBA & EMS
Good Services SMT, BGA and DIP
Production Type SMT & DIP & Assembling & Testing
Certificate UL94V-0+RoHS
Services OEM&ODM Manufacturer Since 2005
Item Control Board PCBA

Product Description

Product Description Dual Camera Screen Arm Android Linux Ubuntu Industrial Embedded Development Board System CPU Rockchip RK3399,ARM Dual Core A72, 4Core A53,UP to 1.8GHz GPU 4Core Mali-T860 RAM With Standard 2GB/4GB LPDDR4 R0M With Standard 16GB EMMC,Up to 128GB Display ...

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Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 5.0/5.0

(1 Reviews)

Main Products PCB Assembly, Robotic Control PCB Assembly, Industrial Control PCBA, Medical PCBA, ...
Address 2-3 Floor, Building 15, Hualun Technology Park , No161 Fenghuang Xingye Road One, Fuyong town, Bao'an Distict, Shenzhen, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, CIF, CIP, EXW, Others
Terms of Payment T/T
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month

Android Development Board Comparison

	Rk3399 Industrial Embedded Development Board Dual Camera Screen Android System Contact Now	Elsky Thin Fan Mini-Itx Motherboard with CPU Kaby Lake 7th Gen Core I3-7100 7320 LGA1151 H110 Chipset M. 2 Qm1100 Contact Now	Elsky Thin Fan Mini-Itx Industrial Motherboard with CPU Skylake 6th Gen Core I7-6700 LGA1151 H110 M. 2 Qm1100 Contact Now	Quick View Elsky 120*120mm Nano-Itx Motherboard with CPU Celeron J1900 Bay Trail Soc DDR3 Max 8GB RAM Quad Core Nano9f Contact Now	Elsky Thin Fan Mini-Itx Motherboard with CPU Skylake 6th Gen Core I3-6100 6320 LGA1151 H110 DC12V/19V Qm1100 Contact Now

Transaction Info
	Rk3399 Industrial Embedded Development Board Dual Camera Screen Android System Contact Now	Elsky Thin Fan Mini-Itx Motherboard with CPU Kaby Lake 7th Gen Core I3-7100 7320 LGA1151 H110 Chipset M. 2 Qm1100 Contact Now	Elsky Thin Fan Mini-Itx Industrial Motherboard with CPU Skylake 6th Gen Core I7-6700 LGA1151 H110 M. 2 Qm1100 Contact Now	Quick View Elsky 120*120mm Nano-Itx Motherboard with CPU Celeron J1900 Bay Trail Soc DDR3 Max 8GB RAM Quad Core Nano9f Contact Now	Elsky Thin Fan Mini-Itx Motherboard with CPU Skylake 6th Gen Core I3-6100 6320 LGA1151 H110 DC12V/19V Qm1100 Contact Now
Price	US$64.90-69.90 / Piece	US$140.00-150.00 / Piece	US$201.00-213.00 / Piece	US$60.00-69.00 / Piece	US$114.00-123.00 / Piece
Min Order	2 Pieces	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union
Quality Control
Product Certification	UL94V-0+RoHS	-	-	-	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand, ODM, OEM	Own Brand, ODM, OEM	Own Brand, ODM, OEM	Own Brand, ODM, OEM
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month
Product Attributes
Specification	Integrated Graphics: Integrated Graphics; Main Chipset: Rockchip; Maximum Memory Capacity: 8G; Structure: ATX; Memory: DDR2; SATA Interface: SATA3.0; CPU Socket: LGA 775; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: HiFi; Name: PCBA Assembly Manufacturing; Inspection: 100% IQC, Ipqc, Fqc, QA, Ict; Advantages: PCB Design/Assembly, PCBA & EMS; Good Services: SMT, BGA and DIP; Production Type: SMT & DIP & Assembling & Testing; Services: OEM&ODM Manufacturer Since 2005; Item: Control Board PCBA;	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 16G; Structure: Mini-ITX; Memory: DDR4; SATA Interface: SATA3.0; CPU Socket: LGA1151; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: Integrated Realtek Alc662 HD Digital Audio Decoder;	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 16G; Structure: Mini-ITX; Memory: DDR4; SATA Interface: SATA3.0; CPU Socket: LGA1151; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: Integrated Realtek Alc662 HD Digital Audio Decoder;	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 8G; Structure: Nano-Itx; Memory: DDR3; SATA Interface: Msata2.0; CPU Socket: Fcbga1170; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: Integrated Cmedia HS-100b USB Audio Chip;	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 16G; Structure: Mini-ITX; Memory: DDR4; SATA Interface: SATA3.0; CPU Socket: LGA1151; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: Integrated Realtek Alc662 HD Digital Audio Decoder; Hard Disk: M.2;
Supplier Name	Shenzhen Grandtop Electronics Co., Ltd.	Shenzhen Elsky Technology Co., Ltd.	Shenzhen Elsky Technology Co., Ltd.	Shenzhen Elsky Technology Co., Ltd.	Shenzhen Elsky Technology Co., Ltd.
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