Android Development Board

US$56.90-60.60 / Piece

Rockchip Rk3568 Quad-Core Dual Screen Embedded Industrial Open Source Development Board pictures & photos

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What is Rockchip Rk3568 Quad-Core Dual Screen Embedded Industrial Open Source Development Board

Name: Rockchip Rk3568 Quad-Core Dual Screen Embedded Industrial Open Source Development Board
Uploaded: 2025-12-20T09:08:05+08:00
Description: Product Description Rockchip RK3568 Quad-core Dual Screen Embedded Industrial Open Source Development Board System CPU Rockchip RK3568,ARM 4Core A55,UP to 2.0GHz GPU Mali-G52 2EE NPU Suppor

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About this Item

Price

Min. Order Reference FOB Price

2 Pieces US$56.90-60.60 / Piece

Sepcifications

Integrated Graphics Integrated Graphics
Main Chipset Rockchip
Maximum Memory Capacity 8G
Structure ATX
Memory DDR2
SATA Interface SATA3.0
CPU Socket LGA 775
Printed Circuit Board Six Layer
Main Board Structure Integrated
Audio Effects HiFi
Transport Package Inner-Plastic Bag; Outer-Standard Carton Box
Specification Customized
Trademark customized
Origin Shenzhen, China
Name PCBA Assembly Manufacturing
Inspection 100% IQC, Ipqc, Fqc, QA, Ict
Advantages PCB Design/Assembly, PCBA & EMS
Good Services SMT, BGA and DIP
Production Type SMT & DIP & Assembling & Testing
Certificate UL94V-0+RoHS
Services OEM&ODM Manufacturer Since 2005
Item Control Board PCBA

Product Description

Product Description Rockchip RK3568 Quad-core Dual Screen Embedded Industrial Open Source Development Board System CPU Rockchip RK3568,ARM 4Core A55,UP to 2.0GHz GPU Mali-G52 2EE NPU Support 1Tops Computing power RAM With Standard 2GB/4GB/8GB LPDDR4 R0M With Standard ...

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Shenzhen Grandtop Electronics Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 5.0/5.0

(1 Reviews)

Main Products PCB Assembly, Robotic Control PCB Assembly, Industrial Control PCBA, Medical PCBA, ...
Address 2-3 Floor, Building 15, Hualun Technology Park , No161 Fenghuang Xingye Road One, Fuyong town, Bao'an Distict, Shenzhen, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, CIF, CIP, EXW, Others
Terms of Payment T/T
Average Lead Time Peak Season Lead Time: one month
Off Season Lead Time: one month

Android Development Board Comparison

	Rockchip Rk3568 Quad-Core Dual Screen Embedded Industrial Open Source Development Board Contact Now	Intel B250 LGA1151 6 LAN Pcie X16 PCI ATX Motherboard Contact Now	Intel H81 4th 5th 1 LAN Pcie X16 PCI ATX Motherboard Contact Now	D2 Motherboard Fmb-75W-E V2.1 Contact Now	Quick View Intel B250 6/7/8/9th LGA1151 6LAN 6COM Pcie X16 ATX Motherboard Contact Now

Transaction Info
	Rockchip Rk3568 Quad-Core Dual Screen Embedded Industrial Open Source Development Board Contact Now	Intel B250 LGA1151 6 LAN Pcie X16 PCI ATX Motherboard Contact Now	Intel H81 4th 5th 1 LAN Pcie X16 PCI ATX Motherboard Contact Now	D2 Motherboard Fmb-75W-E V2.1 Contact Now	Quick View Intel B250 6/7/8/9th LGA1151 6LAN 6COM Pcie X16 ATX Motherboard Contact Now
Price	US$56.90-60.60 / Piece	US$71.00-204.00 / Piece	US$71.00-204.00 / Piece	US$71.00-204.00 / Piece	US$71.00-204.00 / Piece
Min Order	2 Pieces	5 Pieces	5 Pieces	5 Pieces	5 Pieces
Payment Terms	T/T	T/T, PayPal	T/T, PayPal	T/T, PayPal	T/T, PayPal
Quality Control
Product Certification	UL94V-0+RoHS	CE, RoHS, FCC, Kc	CE, RoHS, FCC, Kc	CE, RoHS, FCC, Kc	CE, RoHS, FCC, Kc
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Integrated Graphics: Integrated Graphics; Main Chipset: Rockchip; Maximum Memory Capacity: 8G; Structure: ATX; Memory: DDR2; SATA Interface: SATA3.0; CPU Socket: LGA 775; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: HiFi; Name: PCBA Assembly Manufacturing; Inspection: 100% IQC, Ipqc, Fqc, QA, Ict; Advantages: PCB Design/Assembly, PCBA & EMS; Good Services: SMT, BGA and DIP; Production Type: SMT & DIP & Assembling & Testing; Services: OEM&ODM Manufacturer Since 2005; Item: Control Board PCBA;	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 128GB; Structure: ATX; Memory: 4DDR4;* SATA Interface: SATA3.0; CPU Socket: Standard; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: HiFi; Processor1: 6th/7th/8th/9th Intel® LGA11151 CPU; Chipset: B365; RAM: 4DDR4 SODIMM,64GB;* Power: 24+8 ATX; Ethernet Ports: 6Intel I210;* Storage: 4 SATA3.0,1M.2; System: Windows 10/Windows 11/Linux; USB3.2: 8 USB 3.2 Gen1;* Extension Slot1: 4 PCI, 1 * Pcie X16, 2 * Pcie X4;* COM: 6; Display1: HDMI+VGA; Temp.: Working:-10-60;Storage:-20-70; Dimmension: 300mm244mm;*	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 128GB; Structure: ATX; Memory: 4DDR4;* SATA Interface: SATA3.0; CPU Socket: Standard; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: HiFi; Processor1: 6th/7th/8th/9th Intel® LGA11151 CPU; Chipset: B365; RAM: 4DDR4 SODIMM,64GB;* Power: 24+8 ATX; Ethernet Ports: 6Intel I210;* Storage: 4 SATA3.0,1M.2; System: Windows 10/Windows 11/Linux; USB3.2: 8 USB 3.2 Gen1;* Extension Slot1: 4 PCI, 1 * Pcie X16, 2 * Pcie X4;* COM: 6; Display1: HDMI+VGA; Temp.: Working:-10-60;Storage:-20-70; Dimmension: 300mm244mm;*	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 128GB; Structure: ATX; Memory: 4DDR4;* SATA Interface: SATA3.0; CPU Socket: Standard; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: HiFi; Processor1: 6th/7th/8th/9th Intel® LGA11151 CPU; Chipset: B365; RAM: 4DDR4 SODIMM,64GB;* Power: 24+8 ATX; Ethernet Ports: 6Intel I210;* Storage: 4 SATA3.0,1M.2; System: Windows 10/Windows 11/Linux; USB3.2: 8 USB 3.2 Gen1;* Extension Slot1: 4 PCI, 1 * Pcie X16, 2 * Pcie X4;* COM: 6; Display1: HDMI+VGA; Temp.: Working:-10-60;Storage:-20-70; Dimmension: 300mm244mm;*	Integrated Graphics: Integrated Graphics; Main Chipset: Intel; Maximum Memory Capacity: 16G; Structure: ATX; Memory: 2DDR3;* SATA Interface: SATA3.0; CPU Socket: Standard; Printed Circuit Board: Six Layer; Main Board Structure: Integrated; Audio Effects: HiFi; Processor1: 6th/7th/8th/9th Intel® LGA11151 CPU; Chipset: B250; RAM: 2DDR3 SODIMM,16GB;* Power: 24+8 ATX; Ethernet Ports: 6Intel I210;* Storage: 2 SATA3.0,1Msata; System: Windows 10/Windows 11/Linux; USB3.2: 6 USB 3.2 Gen1;* Extension Slot1: 4 PCI, 1 * Pcie X16;* COM: 6; Display1: HDMI+VGA; Temp.: Working:-10-60;Storage:-20-70; Dimmension: 180mm180mm;*
Supplier Name	Shenzhen Grandtop Electronics Co., Ltd.	R&O Industrial Technology Co., Limited	R&O Industrial Technology Co., Limited	R&O Industrial Technology Co., Limited	R&O Industrial Technology Co., Limited
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