PCBA Manufacturing

US$0.03-10.00 / Piece

Motherboard OEM Manufacturing PCBA Shenzhen Factory pictures & photos

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What is Motherboard OEM Manufacturing PCBA Shenzhen Factory

Name: Motherboard OEM Manufacturing PCBA Shenzhen Factory
Uploaded: 2026-01-07T00:45:31+08:00
Description: Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.08

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About this Item

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$10.00

100-999 Pieces US$0.80

1,000-9,999 Pieces US$0.60

10,000+ Pieces US$0.03

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China
Capacity 1000000
OEM/ODM Available
Sample Available
Surface Treatment OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes
Test 100%E-Testing
Min Bonding Pad Diameter 10mil
Min Thickness of Soldermask 10um
Color of Silk-Screen White, Yellow, Black
Data File Format Gerber File and Drilling File, Protel Series, ...
Material for PCB Fr-4, High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

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Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Year of Establishment 2022-05-11
Number of Employees 10
Address A904, plant 3, Longgang Tian'an Digital Innovation Park, No. 449, Huangge North Road, huanggekeng community, Longcheng street, Longgang District, Shenzhen

PCBA Manufacturing Comparison

	Motherboard OEM Manufacturing PCBA Shenzhen Factory Contact Now	Quick View 4L Fr4 Multilayer Pcbs, Printed Circuit Board Manufacturer From China Contact Now	Quick View Printed Circuit Board, Multilayer PCB with 50ohms Impendence Control. Contact Now	Quick View Multilayer PCB with Hard Gold Finger, Supplier and Manufacturer. Contact Now	Quick View High Quality and Competitive PCB, Multilayer PCB, Double-Sided PCB Contact Now

Transaction Info
	Motherboard OEM Manufacturing PCBA Shenzhen Factory Contact Now	Quick View 4L Fr4 Multilayer Pcbs, Printed Circuit Board Manufacturer From China Contact Now	Quick View Printed Circuit Board, Multilayer PCB with 50ohms Impendence Control. Contact Now	Quick View Multilayer PCB with Hard Gold Finger, Supplier and Manufacturer. Contact Now	Quick View High Quality and Competitive PCB, Multilayer PCB, Double-Sided PCB Contact Now
Price	US$0.03-10.00 / Piece	US$0.35-0.50 / Piece	US$0.35-0.50 / Piece	US$0.35-0.50 / Piece	US$0.35-0.50 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	-	-	-	-
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series, ...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Board Thickness: 1.6mm; Board Layer: 4 Layers; Copper Thickness: 1 Oz; Solder Mask: Blue; Silksreen: White; Surface Finihsing: OSP; Lead Time: 6-8 Working Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Board Thickness: 1.6mm; Board Layer: 4 Layers; Copper Thickness: 1 Oz; Solder Mask: Blue; Silksreen: White; Surface Finihsing: OSP; Lead Time: 6-8 Working Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: FL; Board Thickness: 1.6mm; Board Layer: 4 Layers; Copper Thickness: 1 Oz; Solder Mask: Blue; Silksreen: White; Surface Finihsing: OSP; Lead Time: 6-8 Working Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Board Thickness: 1.6mm; Board Layer: 4 Layers; Copper Thickness: 1 Oz; Solder Mask: Blue; Silksreen: White; Surface Finihsing: OSP; Lead Time: 6-8 Working Days;
Supplier Name	Shenzhen New Chip international Ltd	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited
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