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      OSP Multilayer PCB
      US$0.35-0.50 / Piece
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      What is 4L Fr4 Multilayer Pcbs, Printed Circuit Board Manufacturer From China

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-999 Pieces US$0.50

      1,000-4,999 Pieces US$0.35

      5,000+ Pieces US$0.40

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Medical Instruments
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Fr4
      • Insulation Materials Epoxy Resin
      • Transport Package Vacuum+Carton Packing
      • Specification RoHS, ISO9001, UL, SGS
      • Trademark FL
      • Origin Shenzhen, China
      • Board Thickness 1.6mm
      • Board Layer 4 Layers
      • Copper Thickness 1 Oz
      • Solder Mask Blue
      • Silksreen White
      • Surface Finihsing OSP
      • Lead Time 6-8 Working Days

      Product Description

      Products Introduction Parameters &Data Sheet PCB SIZE 32 x 45mm=1PCS BOARD TYPE Number of Layers Multilayer PCB, 4 Layer PCB Surface Mount Components YES Through Hole Components YES LAYER STACKUP copper ------- 17.5 um(0.5 oz)+plate TOP layer Prepreg 7628 0.195mm copper ...

      Learn More

      OSP Multilayer PCB Comparison
      Transaction Info
      Price US$0.35-0.50 / Piece US$0.10-1.00 / Piece US$2.00-5.00 / Piece US$2.00-5.00 / Piece US$1.00-100.00 / Square Meter
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Square Meter
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T LC, T/T, D/P, Western Union, Small-amount payment, PayPal LC, T/T, D/P, Western Union, Small-amount payment, PayPal T/T, LC, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification - ISO9001,ISO14001,ISO13485,Ts-16949,etc - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Western Europe Europe Europe East Asia(Japan/ South Korea), Domestic
      Annual Export Revenue - - 59,508,592 RMB 59,508,592 RMB -
      Business Model - - OEM OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Thickness: 1.6mm;
      Board Layer: 4 Layers;
      Copper Thickness: 1 Oz;
      Solder Mask: Blue;
      Silksreen: White;
      Surface Finihsing: OSP;
      Lead Time: 6-8 Working Days;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Kevis;
      Products Name: PCBA Assembly PCB Electronic Motherboard;
      Layer: Single / Double Sided / Multilayer;
      Service: PCB/PCBA/PCB Assembly/Electronic Parts;
      Other Service: Layout Design,Engineering Support,Testing;
      Specialised: Medical,Industrial,Communication,Controlboard,LED;
      PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
      Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
      Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
      Min.Hole Size: 0.1mm (4 Mil);
      Board Thickness: 0.2mm-7mm;
      Min.Line Spacing: 0.1mm (4 Mil);
      Solder Color: Green, Red, White, Black,Yellow,Blue;
      SMT Assembly Line: 10 Lines;
      Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Communication;
      Flame Retardant Properties: 94V-0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Finestpcb;
      Service: One-Step PCB Service;
      Solder Mask Color: Blue.Green.Red.Black.White;
      Layer: 1-40layers;
      Min BGA Ball Pitch: 0.4mm;
      Surface Finishing: HASL\OSP\Immersion Gold;
      HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
      Copper Thickness: 0.5-5oz;
      Board Thickness: 1.6 ±0.1mm;
      Minimum Hole: Minimum;
      Minimum Width: 3/3mil;
      Minimum Line: 3/3mil;
      Product Name: OEM PCB PCBA Board Assembly;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Communication;
      Flame Retardant Properties: 94V-0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Finestpcb;
      Service: One-Step PCB Service;
      Solder Mask Color: Blue.Green.Red.Black.White;
      Layer: 1-40layers;
      Min BGA Ball Pitch: 0.4mm;
      Surface Finishing: HASL\OSP\Immersion Gold;
      HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg;
      Copper Thickness: 0.5-5oz;
      Board Thickness: 1.6 ±0.1mm;
      Minimum Hole: Minimum;
      Minimum Width: 3/3mil;
      Minimum Line: 3/3mil;
      Product Name: OEM PCB PCBA Board Assembly;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Aerospace;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: Hemeil;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Finest Printed Circuit Board Ltd.

      Diamond Member Audited Supplier

      Finest Printed Circuit Board Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hemeilin Technology Co., Ltd.

      Gold Member Audited Supplier

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