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      PCBA Manufacturing
      US$0.03-10.00 / Piece
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      What is Multilayer PCB PCB Circuit Board PCB Assembly and Other PCBA Manufacturer

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 Pieces US$10.00

      100-999 Pieces US$0.80

      1,000-9,999 Pieces US$0.60

      10,000+ Pieces US$0.03

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy Resin + Polyimide Resin
      • Application Consumer Electronics
      • Flame Retardant Properties V2
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Brand New Chip
      • Transport Package Foam Packing
      • Specification FR4 1-4 Layers
      • Trademark New Chip
      • Origin China
      • Capacity 1000000
      • OEM/ODM Available
      • Sample Available
      • Surface Treatment OSP, Enig, HASL, AG Immersion
      • Certificate Gurantee Yes
      • Test 100%E-Testing
      • Min Bonding Pad Diameter 10mil
      • Min Thickness of Soldermask 10um
      • Color of Silk-Screen White, Yellow, Black
      • Data File Format Gerber File and Drilling File, Protel Series, ...
      • Material for PCB High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari
      • Layer Count 1-20 Layers
      • Shipping DHL/UPS/FedEx/Air/Sea

      Product Description

      Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

      Learn More

      PCBA Manufacturing Comparison
      Transaction Info
      Price US$0.03-10.00 / Piece US$5.00-30.00 / Piece US$5.00-30.00 / Piece US$2.68-5.60 / Piece US$0.50-1.00 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 10 Pieces
      Payment Terms T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification - ISO9001/ISO14001/ISO13485/Ts16949/CE/RoHS ISO9001/ISO14001/ISO13485/Ts16949/CE/RoHS RoHS/ISO9001/Ts16949/ISO14001/ISO13485 -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia Europe Europe Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
      Annual Export Revenue - - - - -
      Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM -
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series, ...;
      Material for PCB: High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Mu Star;
      Product Name: PCB Circuit Board PCBA;
      MOQ: 1PCS;
      Layers: 1-64 Layers;
      Board Thickness: 0.4mm-10.0mm;
      Copper Thickness: 1-10oz;
      Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
      Surface Finishing: HASL(Lead-Free), Enig, Immersion Gold, Immersion T;
      Service: PCB, Components, PCBA, SMT, DIP, Testing Service;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Mu Star;
      Product Name: PCB Circuit Board PCBA;
      MOQ: 1PCS;
      Layers: 1-64 Layers;
      Board Thickness: 0.4mm-10.0mm;
      Copper Thickness: 1-10oz;
      Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
      Surface Finishing: HASL(Lead-Free), Enig, Immersion Gold, Immersion T;
      Service: PCB, Components, PCBA, SMT, DIP, Testing Service;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Mustar;
      Copper Thickness: 1-12 Oz;
      Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
      Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
      Minimum Line Width Spacing: 0.015mm;
      Minimum Line Spacing: 0.015mm;
      Testing Service: Ict, Function Test, X-ray, Aoi;
      MOQ: 1 PCS;
      Layers: 1-64;
      Warranty: 2 Years;
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Aerospace;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: Mustar;
      D/C: Standard;
      Condition: New Original;
      Warranty: 2 Years;
      Mountng Type: SMT ,DIP;
      Memory Type: Standard;
      Supplier Name

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Mu Star (Shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Mu Star (Shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Mu Star (Shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

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