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      PCB
      US$0.50-4.50 / Piece
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      What is Shenzhen Customized Multilayer Prototype PCB Assembly Manufacturer Provide SMT Electronics Circuit Board

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.50-4.50 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Communication
      • Flame Retardant Properties V2
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Brand New Chip
      • Transport Package Vacuum Packaging, Carton Box
      • Specification FR-4 SILICON COMPONENTS
      • Trademark New Chip
      • Origin China
      • Layer 1-32 Layers
      • Service OEM/ODM
      • OEM/ODM Available
      • Test 100%E-Testing
      • Layer Count 1-20 Layers
      • Shipping DHL/UPS/FedEx/Air/Sea
      • Surface Treatmen OSP, Enig, HASL, AG Immersion
      • Certificate Gurantee Yes

      Product Description

      Product Description What we offer: Products Application: Communication, internet, industrial control, computer application, consumptive electronics, spaceflight, curative application Etc. Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Taconic, Rogers*, ...

      Learn More

      PCB Comparison
      Transaction Info
      Price US$0.50-4.50 / Piece US$2.68-5.60 / Piece US$2.68-5.60 / Piece US$2.68-5.60 / Piece US$2.68-5.60 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification - RoHS/ISO9001/Ts16949/ISO14001/ISO13485 RoHS/ISO9001/Ts16949/ISO14001/ISO13485 RoHS/ISO9001/Ts16949/ISO14001/ISO13485 RoHS/ISO9001/Ts16949/ISO14001/ISO13485
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Layer: 1-32 Layers;
      Service: OEM/ODM;
      OEM/ODM: Available;
      Test: 100%E-Testing;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Surface Treatmen: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Mustar;
      Copper Thickness: 1-12 Oz;
      Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
      Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
      Minimum Line Spacing: 0.015mm;
      Minimum Line Width Spacing: 0.015mm;
      Testing Service: Ict, Function Test, X-ray, Aoi;
      MOQ: 1PCS;
      Layers: 1-64;
      Warranty: 2 Years;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Mustar;
      Copper Thickness: 1-12 Oz;
      Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
      Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
      Minimum Line Spacing: 0.015mm;
      Minimum Line Width Spacing: 0.015mm;
      Testing Service: Ict, Function Test, X-ray, Aoi;
      MOQ: 1PCS;
      Layers: 1-64;
      Warranty: 2 Years;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Mustar;
      Copper Thickness: 1-12 Oz;
      Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
      Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
      Minimum Line Spacing: 0.015mm;
      Minimum Line Width Spacing: 0.015mm;
      Testing Service: Ict, Function Test, X-ray, Aoi;
      MOQ: 1PCS;
      Layers: 1-64;
      Warranty: 2 Years;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Mustar;
      Copper Thickness: 1-12 Oz;
      Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
      Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
      Minimum Line Spacing: 0.015mm;
      Minimum Line Width Spacing: 0.015mm;
      Testing Service: Ict, Function Test, X-ray, Aoi;
      MOQ: 1PCS;
      Layers: 1-64;
      Warranty: 2 Years;
      Supplier Name

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

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