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      PCBA
      US$5.00-30.00 / Piece
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      What is OEM Micro Inverter Electronic Control Board PCB Assembly PCBA for Solar Panel Systems

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-999 Pieces US$30.00

      1,000-2,999 Pieces US$10.00

      3,000-4,999 Pieces US$7.00

      5,000+ Pieces US$5.00

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy Resin + Polyimide Resin
      • Application New Energy
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Brand Mu Star
      • Transport Package DHL, FedEx, UPS, EMS
      • Specification Customized
      • Trademark Customized
      • Origin China
      • Product Name PCB Circuit Board PCBA
      • MOQ 1PCS
      • Layers 1-64 Layers
      • Board Thickness 0.4mm-10.0mm
      • Copper Thickness 1-10oz
      • Solder Mask Color White.Black.Yellow.Green.Red.Blue
      • Surface Finishing HASL(Lead-Free), Enig, Immersion Gold, Immersion T
      • Service PCB, Components, PCBA, SMT, DIP, Testing Service
      • Certificate ISO9001/ISO14001/ISO13485/Ts16949/CE/RoHS

      Product Description

      Welcome to Mu Star (Shenzhen) Industry Co., LTD OEM Micro Inverter Electronic Control Board PCB Assembly PCBA for Solar Panel Systems Product Description Our Advantage: 1. Program and functional test and package by Free. 2. High quality: IPC-A-610E standard, E-test, X-ray, AOI test, QC, 100% ...

      Learn More

      PCBA Comparison
      Transaction Info
      Price US$5.00-30.00 / Piece US$0.03-10.00 / Piece US$0.03-10.00 / Piece US$0.03-10.00 / Piece US$0.88-20.00 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union
      Quality Control
      Product Certification ISO9001/ISO14001/ISO13485/Ts16949/CE/RoHS - - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: New Energy;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Mu Star;
      Product Name: PCB Circuit Board PCBA;
      MOQ: 1PCS;
      Layers: 1-64 Layers;
      Board Thickness: 0.4mm-10.0mm;
      Copper Thickness: 1-10oz;
      Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
      Surface Finishing: HASL(Lead-Free), Enig, Immersion Gold, Immersion T;
      Service: PCB, Components, PCBA, SMT, DIP, Testing Service;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series,...;
      Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series,...;
      Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series,...;
      Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: New Chip;
      Layer: 1-32 Layers;
      Service: OEM/ODM;
      OEM/ODM: Available;
      Test: 100%E-Testing;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Surface Treatmen: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Supplier Name

      Mu Star (Shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

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