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Power Management Cooling Fan Expansion Board Computer Single Board OEM PCBA Manufacturing Raspberry Pi 4 pictures & photos

Power Management Cooling Fan Expansion Board Computer Single Board OEM PCBA Manufacturing Raspberry Pi 4

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About this Item

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$10.00

100-999 Pieces US$0.80

1,000-9,999 Pieces US$0.60

10,000+ Pieces US$0.03

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy Resin + Polyimide Resin
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand New Chip
Transport Package Foam Packing
Specification FR4 1-4 Layers
Trademark New Chip
Origin China
Capacity 1000000
OEM/ODM Available
Sample Available
Surface Treatment OSP, Enig, HASL, AG Immersion
Certificate Gurantee Yes
Test 100%E-Testing
Min Bonding Pad Diameter 10mil
Min Thickness of Soldermask 10um
Color of Silk-Screen White, Yellow, Black
Data File Format Gerber File and Drilling File, Protel Series,...
Material for PCB Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari
Layer Count 1-20 Layers
Shipping DHL/UPS/FedEx/Air/Sea

Product Description

Company Service Specifications Details Material Type FR-4, CEM-1, CEM-3, Aluminium Clad,Arlon*,Teflon,Taconic, Rogers*, Polyimide*, Kapton,Dupont Material Thickness ( in inches) 0.062", 0.080", 0.093", 0.125", 0.220", 0.047", 0.031", 0.020", 0.005" Layer count 1 to 28 Layers Max. ...

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Shenzhen New Chip international Ltd

Gold Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCB, PCBA, Component Chip
Year of Establishment 2022-05-11
Number of Employees 10
Address A904, plant 3, Longgang Tian'an Digital Innovation Park, No. 449, Huangge North Road, huanggekeng community, Longcheng street, Longgang District, Shenzhen

PCBA Manufacturing Comparison

	Power Management Cooling Fan Expansion Board Computer Single Board OEM PCBA Manufacturing Raspberry Pi 4 Contact Now	Quick View Aluminum PCB Board LED Display PCB Metal Circuit PCB Board 94V0 Fr4 PCB Manufacturer Contact Now	8kw (380V) Commercial Digital Heating Module Induction Cooker Contact Now	Magnetic Control Switch Cookermore Induction Cooker Contact Now	15kw (380V) Commercial Digital Heating Module Induction Cooker Contact Now

Transaction Info
	Power Management Cooling Fan Expansion Board Computer Single Board OEM PCBA Manufacturing Raspberry Pi 4 Contact Now	Quick View Aluminum PCB Board LED Display PCB Metal Circuit PCB Board 94V0 Fr4 PCB Manufacturer Contact Now	8kw (380V) Commercial Digital Heating Module Induction Cooker Contact Now	Magnetic Control Switch Cookermore Induction Cooker Contact Now	15kw (380V) Commercial Digital Heating Module Induction Cooker Contact Now
Price	US$0.03-10.00 / Piece	US$0.25-1.00 / Piece	US$71.00 / Piece	US$11.80 / Piece	US$141.00-143.00 / Piece
Min Order	1 Piece	1 Piece	500 Pieces	500 Pieces	100 Pieces
Payment Terms	T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Product Certification	-	ISO9001/IATF16949/ISO13485/CE/RoHS	-	-	-
Management System Certification	-	Others	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, Eastern Europe, Africa, Mid East, Western Europe	North America, South America, Southeast Asia	North America, South America, Southeast Asia	North America, South America, Southeast Asia
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	Own Brand, ODM, OEM	-	-	-
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: 1-3 months Off Season Lead Time: 3-6 months	Peak Season Lead Time: 1-3 months Off Season Lead Time: 3-6 months	Peak Season Lead Time: 1-3 months Off Season Lead Time: 3-6 months
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series,...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: OEM; Product Name: Turnkey PCB Assembly Services; Quality Grade: Ipca610; Surface Finish: Lead/Lead-Free HASL/Immersion Gold; SMT Capacity: 3 Million~4 Million Soldering Pad/Day; DIP Capacity: 100 Thousand Pins/Day; PCB Material: Fr4, Cem1-Cem3, Rogers, Aluminum Copper; Older Resist Color: Green;Red;Yellow;Black;White; Qty: No MOQ; Delivery Time: Sample Is Available Within 3days; Testing Service: 100% Aoi Lct Fct Testing; Design: PCB Design, PCB Layout, PCB Clone; PCBA Layer: 1-32 Layers; Copper Thickness: 18um-210um(6oz); OEM Service: PCB Manufacturing, Compoments Sourcing, PCB Assemb;	Type: Combining Rigid Circuit Board; Dielectric: CEM-3; Material: Complex; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Cookermore; Weight(Kg): 2.18;	Type: Combining Rigid Circuit Board; Dielectric: CEM-3; Material: Complex; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Cookermore; Weight(Kg): 0.13;	Type: Combining Rigid Circuit Board; Dielectric: CEM-3; Material: Complex; Application: Communication; Flame Retardant Properties: HB; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Cookermore; Weight(Kg): 2.25;
Supplier Name	Shenzhen New Chip international Ltd	Shenzhen Jingxin Electronic Technology Co., Ltd.	Guangdong Cookermore CO., Ltd	Guangdong Cookermore CO., Ltd	Guangdong Cookermore CO., Ltd
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