| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Mustar;
Copper Thickness: 1-12 Oz;
Board Thickness: 0.8, 1.0, 1.2, 1.6, 2, 2.4mm;
Surface Finishing: HASL,Immersion Gold,Flash Gold, Plated Silver, OSP;
Minimum Line Spacing: 0.015mm;
Minimum Line Width Spacing: 0.015mm;
Testing Service: Ict, Function Test, X-ray, Aoi;
MOQ: 1PCS;
Layers: 1-64;
Warranty: 2 Years;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Customerised;
Surface Finish: Immersion Gold;
Overal Board Thickness: 6.35mm;
Min Hole: 0.1mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM;
Board Thickness: 0.5-3 mm;
Copper Thickness: 0.5-8 Oz;
Material Type: Fr-4;
Surface Finish: HASL/OSP/Enig/Enepig/Imsn/Imag;
Solder Mask Colors: Green/White/Blue/Black/Red;
Silk Screen Colors: White / Black;
Board Layer: 1-50 Layers;
Lead Time: 5-15 Days;
Service: OEM/ODM;
Min Hole: 0.1mm;
Min Trace: 3/3mil;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Communication;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Customized;
Board Thickness: 0.5-3 mm;
Copper Thickness: 0.5-8 Oz;
Material Type: Fr-4;
Surface Finish: HASL/OSP/Enig/Enepig/Imsn/Imag;
Solder Mask Colors: Green/White/Blue/Black/Red;
Silk Screen Colors: White / Black;
Board Layer: 1-50 Layers;
Lead Time: 5-15 Days;
Service: OEM/ODM;
Min Hole: 0.1mm;
Min Trace: 3/3mil;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Application: Communication;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Customized;
Board Thickness: 0.5-3 mm;
Copper Thickness: 0.5-8 Oz;
Material Type: Fr-4;
Surface Finish: HASL/OSP/Enig/Enepig/Imsn/Imag;
Solder Mask Colors: Green/White/Blue/Black/Red;
Silk Screen Colors: White / Black;
Board Layer: 1-50 Layers;
Lead Time: 5-15 Days;
Service: OEM/ODM;
Min Hole: 0.1mm;
Min Trace: 3/3mil;
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