Multi Layer PCB Board

US$16.50-19.50 / Piece

UL CE RoHS Multi Layer Rigid Flex HDI FPC Fr4 PCB Enig Enepig Plated Gold Electronic Printed Circuit Board PCBA SMT ODM OEM Assembly Manufacture pictures & photos

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What is UL CE RoHS Multi Layer Rigid Flex HDI FPC Fr4 PCB Enig Enepig Plated Gold Electronic Printed Circuit Board PCBA SMT ODM OEM Assembly Manufacture

Name: UL CE RoHS Multi Layer Rigid Flex HDI FPC Fr4 PCB Enig Enepig Plated Gold Electronic Printed Circuit Board PCBA SMT ODM OEM Assembly Manufacture
Uploaded: 2025-12-21T07:27:45+08:00
Description: UL CE RoHS Multi Layer Rigid Flex HDI FPC FR4 PCB Enig Enepig Plated Gold Electronic Printed Circuit Board PCBA SMT ODM OEM Assembly Manufacture Product Parameters Product Parameters Model NO. CK-PCB

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About this Item

Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$19.50

100-999 Pieces US$18.50

1,000-9,999 Pieces US$17.50

10,000+ Pieces US$16.50

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Brand OEM
Transport Package Vacuum + Carton Packing
Specification PCB PCBA
Trademark Fastline
Origin Shenzhen, China
Board Thickness 0.5-3 mm
Copper Thickness 0.5-8 Oz
Material Type Fr-4
Surface Finish HASL/OSP/Enig/Enepig/Imsn/Imag
Solder Mask Colors Green/White/Blue/Black/Red
Silk Screen Colors White / Black
Board Layer 1-50 Layers
Lead Time 5-15 Days
Service OEM/ODM
Min Hole 0.1mm
Min Trace 3/3mil

Product Description

UL CE RoHS Multi Layer Rigid Flex HDI FPC FR4 PCB Enig Enepig Plated Gold Electronic Printed Circuit Board PCBA SMT ODM OEM Assembly Manufacture Product Parameters Product Parameters Model NO. CK-PCB Material Fiberglass Epoxy Application Consumer Electronics Flame Retardant Properties ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

Multi Layer PCB Board Comparison

	UL CE RoHS Multi Layer Rigid Flex HDI FPC Fr4 PCB Enig Enepig Plated Gold Electronic Printed Circuit Board PCBA SMT ODM OEM Assembly Manufacture Contact Now	Quick View Chinese PCB Manufacturing Factory Quick-Turn Prototype Copper Substrate PCB 70μ M Tg150° C Customizable Solution Contact Now	Quick View Chinese PCB Manufacturing Factory Copper PCB Substrate 398W/M· K T2 Copper for High-Power Lighting Contact Now	Quick View OEM Manufacturer Single-Sided Thermal-Electric PCB T2 Copper Core Contact Now	Quick View Chinese PCB Manufacturing Factory Thermal-Electric Separation & Flip-Chip Support LED PCB Contact Now

Transaction Info
	UL CE RoHS Multi Layer Rigid Flex HDI FPC Fr4 PCB Enig Enepig Plated Gold Electronic Printed Circuit Board PCBA SMT ODM OEM Assembly Manufacture Contact Now	Quick View Chinese PCB Manufacturing Factory Quick-Turn Prototype Copper Substrate PCB 70μ M Tg150° C Customizable Solution Contact Now	Quick View Chinese PCB Manufacturing Factory Copper PCB Substrate 398W/M· K T2 Copper for High-Power Lighting Contact Now	Quick View OEM Manufacturer Single-Sided Thermal-Electric PCB T2 Copper Core Contact Now	Quick View Chinese PCB Manufacturing Factory Thermal-Electric Separation & Flip-Chip Support LED PCB Contact Now
Price	US$16.50-19.50 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	T/T, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union
Quality Control
Management System Certification	-	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: OEM; Board Thickness: 0.5-3 mm; Copper Thickness: 0.5-8 Oz; Material Type: Fr-4; Surface Finish: HASL/OSP/Enig/Enepig/Imsn/Imag; Solder Mask Colors: Green/White/Blue/Black/Red; Silk Screen Colors: White / Black; Board Layer: 1-50 Layers; Lead Time: 5-15 Days; Service: OEM/ODM; Min Hole: 0.1mm; Min Trace: 3/3mil;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Board Thickness: 2.0mm; Metal Core PCB: Oxygen-Free Copper(OFC) 2.0mm; Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Board Thickness: 0.8mm; Metal Core PCB: T2 High Conductivity Copper(0.8mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 35/35μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Board Thickness: 1.6mm; Metal Core PCB: T2 High Conductivity Copper(1.6mm); Thermal Conductivity: 398W/M-K+Non Thermoelectric Separation Ar; Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Dielectric: MCPCB\Fr4\Bt; Application: New Energy Vehicle Electronic Control Board; Flame Retardant Properties: Customized; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Board Thickness: 1.5mm; Metal Core PCB: T2 High Conductivity Copper(1.5mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 70/70μm; Tg: 150°C;
Supplier Name	Fastline Circuits Co., Limited	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.
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