| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Epoxide Woven Glass Fabric Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Aluminum;
Insulation Materials: Epoxy Resin;
Brand: Jxpcba;
Layer: 1-32 Layers;
Board Thickness: 0.2-8.0mm;
Max. PCB Size: 22inch*22inch or 550mm*550mm;
PCB Material: Fr-4, Cem-1, Cem-3, Hight Tg, Fr4 Halogen Free;
PCB Type: Rigid PCB, Flexible PCB, Rigid-Flexible PCB;
PCB Shape: Rectangular, Round, Slots, Cutouts, Complex, Irreg;
Surface Finish: HASL/HASL Lead Free, Chemical Tin, Chemical Gold;
Solder Mask Color: Green/Black/White/Red/Blue/Yellow, etc;
Copper Thickness: 18um-210um(6oz);
Profiling Punching: Routing, V-Cut, Beveling;
PCBA Packaging: ESD Packaging, Shockproof Packaging, Anti-Drop;
PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
Test: X-ray, Aoi, in-Circuit Test (Ict), Functional Test;
Service: PCB, Components Sourcing and in-House;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Board Layer: 1-24;
Material Finished Thickness: 0.4-3.2mm;
Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red;
PCB Testing: E-Testing, Flying Probe Testing;
Special: Impedance Control, Buried-Blind Vias Holes, HDI;
Lead Time: 5 Working Days;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Board Layer: 1-24;
Material Finished Thickness: 0.4-3.2mm;
Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red;
Lead Time: 5 Working Days;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Board Layer: 1-24;
Special Base Material: High Tg,Rogers, Shenyi,Aluminum;
Material Finished Thickness: 0.4-3.2mm;
Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red;
Special: Impedance Control, Buried-Blind Vias Holes;
PCB Testing: E-Testing, Flying Probe Testing;
Fast Turn: 3 Working Day;
Lead Time: 5 Working Days;
|
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Uc;
Board Layer: 1-24;
Material Finished Thickness: 0.4-3.2mm;
Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve;
Solder Mask Color: Green/White/Black/Blue/Red;
Lead Time: 5 Working Days;
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