Immersion Gold PCB

US$0.10-0.53 / Piece

Multilayer Immersion Gold Printed Circuit Board PCB pictures & photos

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What is Multilayer Immersion Gold Printed Circuit Board PCB

Name: Multilayer Immersion Gold Printed Circuit Board PCB
Uploaded: 2025-12-23T12:00:15+08:00
Description: Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling mach

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About this Item

Price

Purchase Qty. Reference FOB Price

1-9 Pieces US$0.53

10+ Pieces US$0.10

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Copper
Insulation Materials Epoxy Resin
Brand Uc
Transport Package Vacuum Package
Specification IPC class III
Trademark UC
Origin Shenzhen, China
Board Layer 1-24
Material Finished Thickness 0.4-3.2mm
Surface Treatment Immersion Gold/HASL Lead Free/ Immersion Silve
Solder Mask Color Green/White/Black/Blue/Red
Lead Time 5 Working Days
Certificate UL(Us&Canada). ISO9001. RoHS, Ts, SGS

Product Description

Welcome to Ucreate Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic flow ...

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Ucreate PCB Co., Ltd.

Diamond Member Since 2016

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Main Products PCB Board, PCB / Aluminum PCB, Printed Circuit Board / Circuit Board, LED PCB / LED Strip ...
Address Room 315,Building C,Yunhai Enterprise Headquater Base,No.42 Caiyun Road,Jixiang Community,Longcheng Street,Longgang District,Shenzhen,China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
International Commercial Terms(Incoterms) FOB, CIF, DAT, DDP, DAP, EXW
Terms of Payment LC, T/T, D/P, PayPal, Western Union
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Immersion Gold PCB Comparison

	Multilayer Immersion Gold Printed Circuit Board PCB Contact Now	Quick View Good Price Original Raspberry Pi 4 Model B 4GB Rigid-Fr4 HDI Printed Circuit Board Manufacturing PCB Contact Now	Quick View Customized Rigid-Fr4 HDI PCB Circuit Board Manufacturing PCB Contact Now	Fr4 Material Customized Printed Circuit Board PCB Supplier Contact Now	Customized Circuit Board PCB with Fr4 Material Contact Now

Transaction Info
	Multilayer Immersion Gold Printed Circuit Board PCB Contact Now	Quick View Good Price Original Raspberry Pi 4 Model B 4GB Rigid-Fr4 HDI Printed Circuit Board Manufacturing PCB Contact Now	Quick View Customized Rigid-Fr4 HDI PCB Circuit Board Manufacturing PCB Contact Now	Fr4 Material Customized Printed Circuit Board PCB Supplier Contact Now	Customized Circuit Board PCB with Fr4 Material Contact Now
Price	US$0.10-0.53 / Piece	US$0.12-0.68 / piece	US$0.65-3.15 / Piece	US$4.23-6.87 / Piece	US$4.49-5.97 / Piece
Min Order	1 Piece	1 piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	UL(Us&Canada). ISO9001. RoHS, Ts, SGS	-	-	-	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Europe, Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Uc; Board Layer: 1-24; Material Finished Thickness: 0.4-3.2mm; Surface Treatment: Immersion Gold/HASL Lead Free/ Immersion Silve; Solder Mask Color: Green/White/Black/Blue/Red; Lead Time: 5 Working Days;	Structure: Double-Sided Rigid PCB; Dielectric: FR-3; Material: Phenolic Paper Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Fr4; Insulation Materials: Organic Resin; Brand: Fastline; Board Material: Fr4; Layers: 1 to 30 Layers; Board Thickness: 1.6mm; Copper Thickness: 1oz; Solder Mask: Green; Silk Screen: White; Surface Treatment: HASL Lead Free; Test: 100%; Lead Time: 6-8 Working Days; Min. Line Width: 0.075mm;	Structure: Double-Sided Rigid PCB; Dielectric: FR-3; Material: Phenolic Paper Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Semi-Additive Process; Base Material: Fr4; Insulation Materials: Organic Resin; Brand: Fastline; Board Material: Fr4; Layers: 1 to 30 Layers; Board Thickness: 1.6mm; Copper Thickness: 1oz; Solder Mask: Green; Silk Screen: White; Surface Treatment: HASL Lead Free; Test: 100%; Lead Time: 6-8 Working Days; Min. Line Width: 0.075mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Epoxy Resin; Board Thickness: 1.6mm; Board Layer: 4 Layers; Copper Thickness: 2 Oz; Solder Mask: Green; Silksreen: White; Surface Finihsing: OSP; Lead Time: 6-8 Working Days; Test: Fly Probe Testing; Min. Line Space: 0.1mm; Min.Hole Size: 0.15mm;	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Communication; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Epoxy Resin; Board Thickness: 1.6mm; Board Layer: 4 Layers; Copper Thickness: 2 Oz; Solder Mask: Green; Silksreen: White; Surface Finihsing: OSP; Lead Time: 6-8 Working Days; Test: Fly Probe Testing; Min. Line Space: 0.1mm; Min.Hole Size: 0.15mm;
Supplier Name	Ucreate PCB Co., Ltd.	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited	Fastline Circuits Co., Limited
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