| Specification |
Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
Surface Treatment: Gold Finger/Hard Gold;
Layers: 1-36layers;
Board Thickness: 0.2-6mm;
Copper Thickness: 0.5-12oz(18-420um);
Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
Hole Diameter: Min0.05mm;
Min. Line Width: 0.10mm(4mil);
Min. Line Spacing: 0.10mm(4mil);
Test: 100% E-Test;
One Stop Service: PCB Assembly, Component Sourcing, Box Building;
Max. Finished Board Side: 1020mm*1000mm;
MOQ: No;
Sample Date: 5-7days;
Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
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Type: Rigid Circuit Board;
Dielectric: FR-1;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Head Sun;
Machine No. 1: Hds Live 7;
Machine No. 2: Hds Live 9;
Machine No. 3: Hds Live 12;
Machine No. 4: Hds Live 16;
Machine No. 5: Hds Gen 2 Touch 7;
Machine No. 6: Hds Gen 3 Touch 12;
Machine No. 7: Hds Gen 3 Carbon 12;
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Type: Rigid Circuit Board;
Dielectric: Ceramics and PPO;
Material: Polyphenylene Ether, Ceramic;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Wangling;
Thickness: 5.0mm;
Layer Count: Single Layer PCB;
Application: Beidou, Missile-Borne Systems, Fuzes, and Antennas;
Solder Mask: Black;
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Type: Rigid Circuit Board;
Dielectric: FR-1;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Head Sun;
Machine No. 1: Hds Live 7;
Machine No. 2: Hds Live 9;
Machine No. 3: Hds Live 12;
Machine No. 4: Hds Live 16;
Machine No. 5: Hds Gen 2 Touch 7;
Machine No. 6: Hds Gen 3 Touch 12;
Machine No. 7: Hds Gen 3 Carbon 12;
|
Type: Rigid Circuit Board;
Dielectric: FR-1;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V2;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Head Sun;
Machine No. 1: Hds Live 7;
Machine No. 2: Hds Live 9;
Machine No. 3: Hds Live 12;
Machine No. 4: Hds Live 16;
Machine No. 5: Hds Gen 2 Touch 7;
Machine No. 6: Hds Gen 3 Touch 12;
Machine No. 7: Hds Gen 3 Carbon 12;
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