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      PCBA
      US$2.547-3.265 / Piece
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      What is OEM Service PCB Printed Circuit Board Multilayer PCBA Flexible Circuit Board Manufacturing

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-9 Pieces US$3.265

      10-99 Pieces US$3.025

      100-999 Pieces US$2.753

      1,000+ Pieces US$2.547

      Sepcifications

      • Type Combining Rigid Circuit Board
      • Dielectric FR-4
      • Material Complex
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Aluminum
      • Insulation Materials Organic Resin
      • Model PCB
      • Brand Customer's Brand
      • Transport Package Customized, ESD Bag/Vacuum Packaging+Bubble Bag,
      • Specification 49 x 42 x 36 Centimeters/Piece
      • Trademark JXpcba
      • Origin China
      • Surface Treatment Gold Finger/Hard Gold
      • Layers 1-36layers
      • Board Thickness 0.2-6mm
      • Copper Thickness 0.5-12oz(18-420um)
      • Solder Mask Color Green/Black/White/Red/Blue/Yellow
      • Hole Diameter Min0.05mm
      • Min. Line Width 0.10mm(4mil)
      • Min. Line Spacing 0.10mm(4mil)
      • Test 100% E-Test
      • One Stop Service PCB Assembly, Component Sourcing, Box Building
      • Max. Finished Board Side 1020mm*1000mm
      • MOQ No
      • Sample Date 5-7days
      • Certification RoHS, UL, ISO
      • Shipment Air, Sea, Express(DHL TNT FedEx EMS UPS)

      Product Description

      ... Shenzhen Jingxin Electronic Technology Co.,Ltd. ... Built since 2002, is a almost 20 years professional company dedicating to PCB&PCBA industry. Our factory located in Shenzhen, and have dust-free workshop which cover an area of over than 10000m², almost 550 ...

      Learn More

      PCBA Comparison
      Transaction Info
      Price US$2.547-3.265 / Piece US$99.00-499.00 / Piece US$0.90-99.99 / PCS US$99.00-499.00 / Piece Negotiable
      Min Order 1 Piece 2 Pieces 1 PCS 2 Pieces 2 Pieces
      Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T, PayPal Small-amount payment, Western Union, PayPal, D/P, T/T, LC T/T, PayPal T/T, PayPal
      Quality Control
      Product Certification RoHS, UL, ISO - - - -
      Management System Certification Others - - - -
      Trade Capacity
      Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe North America North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America North America
      Annual Export Revenue - 31,406,645.13 RMB - 31,406,645.13 RMB 31,406,645.13 RMB
      Business Model Own Brand, ODM, OEM Own Brand, ODM, OEM ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Complex;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Model: PCB;
      Brand: Customer's Brand;
      Surface Treatment: Gold Finger/Hard Gold;
      Layers: 1-36layers;
      Board Thickness: 0.2-6mm;
      Copper Thickness: 0.5-12oz(18-420um);
      Solder Mask Color: Green/Black/White/Red/Blue/Yellow;
      Hole Diameter: Min0.05mm;
      Min. Line Width: 0.10mm(4mil);
      Min. Line Spacing: 0.10mm(4mil);
      Test: 100% E-Test;
      One Stop Service: PCB Assembly, Component Sourcing, Box Building;
      Max. Finished Board Side: 1020mm*1000mm;
      MOQ: No;
      Sample Date: 5-7days;
      Shipment: Air, Sea, Express(DHL TNT FedEx EMS UPS);
      Type: Rigid Circuit Board;
      Dielectric: FR-1;
      Material: Paper Phenolic Copper Foil Substrate;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Metal Composite Materials;
      Model: PCB;
      Brand: Head Sun;
      Machine No. 1: Hds Live 7;
      Machine No. 2: Hds Live 9;
      Machine No. 3: Hds Live 12;
      Machine No. 4: Hds Live 16;
      Machine No. 5: Hds Gen 2 Touch 7;
      Machine No. 6: Hds Gen 3 Touch 12;
      Machine No. 7: Hds Gen 3 Carbon 12;
      Type: Rigid Circuit Board;
      Dielectric: Ceramics and PPO;
      Material: Polyphenylene Ether, Ceramic;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Brand: Wangling;
      Thickness: 5.0mm;
      Layer Count: Single Layer PCB;
      Application: Beidou, Missile-Borne Systems, Fuzes, and Antennas;
      Solder Mask: Black;
      Type: Rigid Circuit Board;
      Dielectric: FR-1;
      Material: Paper Phenolic Copper Foil Substrate;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Metal Composite Materials;
      Model: PCB;
      Brand: Head Sun;
      Machine No. 1: Hds Live 7;
      Machine No. 2: Hds Live 9;
      Machine No. 3: Hds Live 12;
      Machine No. 4: Hds Live 16;
      Machine No. 5: Hds Gen 2 Touch 7;
      Machine No. 6: Hds Gen 3 Touch 12;
      Machine No. 7: Hds Gen 3 Carbon 12;
      Type: Rigid Circuit Board;
      Dielectric: FR-1;
      Material: Paper Phenolic Copper Foil Substrate;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Metal Composite Materials;
      Model: PCB;
      Brand: Head Sun;
      Machine No. 1: Hds Live 7;
      Machine No. 2: Hds Live 9;
      Machine No. 3: Hds Live 12;
      Machine No. 4: Hds Live 16;
      Machine No. 5: Hds Gen 2 Touch 7;
      Machine No. 6: Hds Gen 3 Touch 12;
      Machine No. 7: Hds Gen 3 Carbon 12;
      Supplier Name

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Head Sun Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Head Sun Co., Ltd.

      Diamond Member Audited Supplier

      Head Sun Co., Ltd.

      Diamond Member Audited Supplier

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