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      Printed Circuit Board
      US$0.90-99.99 / PCS
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      What is Tp1020 Printed Circuit Board of Shenzhen PCB Custom

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 PCS US$99.99

      100+ PCS US$0.90

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric Ceramics and PPO
      • Material Polyphenylene Ether, Ceramic
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Epoxy Resin
      • Model PCB
      • Brand Wangling
      • Transport Package Kk Paper, 3-Layer Wrinkle
      • Specification ≤ 150mm X 220mm
      • Trademark Bicheng
      • Origin Shenzhen China
      • Thickness 5.0mm
      • Layer Count Single Layer PCB
      • Application Beidou, Missile-Borne Systems, Fuzes, and Antennas
      • Solder Mask Black

      Product Description

      TP1020 High Frequency Printed Circuit Board 5.0mm Alternative High DK RF PCB (All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.) General Description This high - frequency printed circuit board (PCB) is constructed on Wangling's TP1020 ...

      Learn More

      Printed Circuit Board Comparison
      Transaction Info
      Price US$0.90-99.99 / PCS US$0.10-5.00 / Piece US$0.10-1.00 / Piece US$0.10-1.00 / Piece US$0.10-1.00 / Piece
      Min Order 1 PCS 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms Small-amount payment, Western Union, PayPal, D/P, T/T, LC T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: Ceramics and PPO;
      Material: Polyphenylene Ether, Ceramic;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Brand: Wangling;
      Thickness: 5.0mm;
      Layer Count: Single Layer PCB;
      Application: Beidou, Missile-Borne Systems, Fuzes, and Antennas;
      Solder Mask: Black;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: OSP;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Teck: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: OSP;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Teck: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: OSP;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Teck: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: OSP;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Model: PCB;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Teck: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Supplier Name

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

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