| Specification |
Type: Combining Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Processing Technology: Delay Pressure Foil;
Application: Consumer Electronics;
Mechanical Rigid: Fexible;
Material: Copper-Based;
Brand: Jxpcb;
PCBA Material: FR4, High TG, Halogen-Free, High Frequency;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Number of Layer: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
PCB Silkscreen Color: Black, White, Yellow;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Processing Technology: OSP;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Processing Technology: OSP;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Processing Technology: OSP;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Processing Technology: OSP;
Mechanical Rigid: Rigid;
Material: Fiberglass Epoxy;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
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