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US$1.23-1.89 / Piece

BGA Multilayer PCB&PCBA Prototyping, Professional PCB Board Assembly Manufacturer PCBA pictures & photos

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What is BGA Multilayer PCB&PCBA Prototyping, Professional PCB Board Assembly Manufacturer PCBA

Name: BGA Multilayer PCB&PCBA Prototyping, Professional PCB Board Assembly Manufacturer PCBA
Uploaded: 2025-12-21T20:18:24+08:00
Description: BGA Multilayer PCB&PCBA Prototyping, Professional PCB Board Assembly Manufacturer PCBA Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Teflon, Rogers, FR-4,

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Price

Purchase Qty. Reference FOB Price

10-99 Pieces US$1.89

100-999 Pieces US$1.68

1,000-1,999 Pieces US$1.52

2,000+ Pieces US$1.23

Sepcifications

Type Rigid Circuit Board
Flame Retardant Properties V2
Dielectric FR-4
Base Material Copper
Insulation Materials Epoxy Resin
Processing Technology Surface Mounted Technolgoy
Application Industry Equipment
Mechanical Rigid Fexible
Material The Paper Ring Gas Resin
Brand Jxpcba
Transport Package Air Bubble Film+Carton
Specification Custom
Trademark JXpcba
Origin China
PCBA Material FR4, High TG, Halogen-Free, High Frequency
Surface Treatment HASL/Immersion Gold/Immersion Silver/Immersion Tin
Certificate ISO9001/ISO14001/IATF16949
PCB Solder Mask White, Black, Yellow, Green, Red, Blue
Component Packing Tary, Tube, Tape
Number of Floors 1-32
Minimum Line Width/Spacing 3.0mil
Maximum Plate Thickness Aperture Ratio 30:1
Minimum Mechanical Drilling Aperture 6mil
Board Thickness 0.2mm~6.0mm
Maximum Board Size 640mm*1100mm
PCBA Testing Service Aoi, Ict, X-ray, Flying Probe Test
PCBA Packaging Static Packaging, Shockproof Packaging, Anti-Drop
Product Application Consumer Electronics/Home Appliances/Medical Equip
PCB Silkscreen Color Black, White, Yellow

Product Description

BGA Multilayer PCB&PCBA Prototyping, Professional PCB Board Assembly Manufacturer PCBA Product Description Specification: PCB layers: 1-24layers PCB materials: CEM1, CEM3, Teflon, Rogers, FR-4, High Tg FR-4, Aluminum Base, Halogen Free PCB max. board size: 620mm*1100mm PCB ...

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Shenzhen Jingxin Electronic Technology Co., Ltd.

Diamond Member Since 2022

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products PCBA, PCB, Print Circuit Board, Flexible Circuit Board, Rigid PCB Assembly, PCB Assembly, ...
Year of Establishment 2006-08-03
Number of Employees 423
Management System Certification Others
Address 2-3f, Building 17, 2f, Building 13 Hongfa Industrial Park, Tangtou, Shenzhen, Guangdong, China

OEM Comparison

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Transaction Info
	BGA Multilayer PCB&PCBA Prototyping, Professional PCB Board Assembly Manufacturer PCBA Contact Now	Quick View Waterproof IP6K9K PCB - 398W/M· K Thermal Separation for Marine Headlights Contact Now	Quick View High-Performance Waterproof IP69K Fr4 PCB for Dock Lighting Contact Now	Quick View Thermal Simulation-Optimized MCPCB - Double-Sided Design OEM Contact Now	Quick View OEM High-Power Surgical Light PCB - Tg150o C T2 Copper with Thermal Separation Contact Now
Price	US$1.23-1.89 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece
Min Order	10 Pieces	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram	T/T, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union
Quality Control
Product Certification	ISO9001/ISO14001/IATF16949	-	-	-	-
Management System Certification	Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets	North America, Eastern Europe, Africa, Mid East, Western Europe	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand, ODM, OEM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Flame Retardant Properties: V2; Dielectric: FR-4; Base Material: Copper; Insulation Materials: Epoxy Resin; Processing Technology: Surface Mounted Technolgoy; Application: Industry Equipment; Mechanical Rigid: Fexible; Material: The Paper Ring Gas Resin; Brand: Jxpcba; PCBA Material: FR4, High TG, Halogen-Free, High Frequency; Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin; PCB Solder Mask: White, Black, Yellow, Green, Red, Blue; Component Packing: Tary, Tube, Tape; Number of Floors: 1-32; Minimum Line Width/Spacing: 3.0mil; Maximum Plate Thickness Aperture Ratio: 30:1; Minimum Mechanical Drilling Aperture: 6mil; Board Thickness: 0.2mm~6.0mm; Maximum Board Size: 640mm1100mm;* PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test; PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop; Product Application: Consumer Electronics/Home Appliances/Medical Equip; PCB Silkscreen Color: Black, White, Yellow;	Type: Combining Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Copper-Based; Brand: Hongyu; Board Thickness: 1.5mm; Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm; Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Copper-Based; Brand: Hongyu; Board Thickness: 1.5mm; Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm; Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 70μm; Tg: 150°C;	Type: Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Aluminum; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: Aluminum 5052 Core (1.2mm); Thermal Conductivity: 2W/M·K (Dielectric Layer); Copper Foil: 70/70μm; Tg: 130°C;	Type: Combining Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Copper-Based; Brand: Hongyu; Board Thickness: 1.5mm; Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm; Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 70μm; Tg: 150°C;
Supplier Name	Shenzhen Jingxin Electronic Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.
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