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      PCB
      US$0.25-1.00 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-499 Pieces US$1.00

      500-999 Pieces US$0.50

      1,000+ Pieces US$0.25

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Brand OEM
      • Transport Package Transport Package
      • Specification 50mm*50mm~510mm*460mm
      • Trademark Printed Circuit Board
      • Origin China
      • Product Name Turnkey PCB Assembly Services
      • Quality Grade Ipca610
      • Surface Finish Lead/Lead-Free HASL/Immersion Gold
      • SMT Capacity 3 Million~4 Million Soldering Pad/Day
      • DIP Capacity 100 Thousand Pins/Day
      • PCB Material High Quality Fr4, Rogers, and Aluminum Material
      • Shipping by DHL, FedEx, UPS
      • Certificate UL, Reach, RoHS and CQC
      • Solder Resist Color Green;Red;Yellow;Black;White
      • Solder Mask Color Yellow;Black;White;
      • Delivery Time Sample Is Available Within 3days
      • Testing Service 100% Aoi Lct Fct Testing
      • Design Original

      Product Description

      Shenzhen Jingxin Electronic Technology Co.,Ltd China PCBA Manufacturer | 23 Years Expertise | 18 SMT + 13 DIP Lines Your Trusted Turnkey PCB Assembly Partner With 23 years of industry experience, we are a leading PCBA manufacturer in China, offering end-to-end solutions from prototyping to ...

      Learn More

      PCB Comparison
      Transaction Info
      Price US$0.25-1.00 / Piece US$0.78-22.31 / Piece US$0.87-5.00 / Piece US$0.89-5.00 / Piece US$0.20-20.00 / Piece
      Min Order 1 Piece 10 Pieces 10 Pieces 10 Pieces 10 Pieces
      Payment Terms LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram T/T T/T T/T T/T
      Quality Control
      Product Certification UL, Reach, RoHS and CQC RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO
      Management System Certification Others ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
      Trade Capacity
      Export Markets North America, Eastern Europe, Africa, Mid East, Western Europe Domestic Domestic Domestic Domestic
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: OEM;
      Product Name: Turnkey PCB Assembly Services;
      Quality Grade: Ipca610;
      Surface Finish: Lead/Lead-Free HASL/Immersion Gold;
      SMT Capacity: 3 Million~4 Million Soldering Pad/Day;
      DIP Capacity: 100 Thousand Pins/Day;
      PCB Material: High Quality Fr4, Rogers, and Aluminum Material;
      Shipping: by DHL, FedEx, UPS;
      Solder Resist Color: Green;Red;Yellow;Black;White;
      Solder Mask Color: Yellow;Black;White;;
      Delivery Time: Sample Is Available Within 3days;
      Testing Service: 100% Aoi Lct Fct Testing;
      Design: Original;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: OEM/ODM;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: OEM/ODM;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: OEM/ODM;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Type: Customized;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: OEM/ODM;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Supplier Name

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

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