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PCB Assembly

US$0.78-22.31 / Piece

Air Conditioning Circuit Board PCBA Amplifier Assembly Smart Home Custom PCB Assembly Video

Name: Air Conditioning Circuit Board PCBA Amplifier Assembly Smart Home Custom PCB Assembly
Uploaded: 2025-12-20T17:47:34+08:00
Description: Air Conditioning Circuit Board PCBA Amplifier Assembly Smart Home Custom PCB Assembly Files and Requirment for PCB,PCBA quotation: A BOM (Bill of Materials) with reference designators: component descr

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Price

Purchase Qty. Reference FOB Price

10-999 Pieces US$5.00

1,000-4,999 Pieces US$22.31

5,000+ Pieces US$0.78

Sepcifications

Dielectric FR-4
Material Aluminum Covered Copper Foil Layer
Application Consumer Electronics
Flame Retardant Properties V0
Base Material Aluminum
Insulation Materials Organic Resin
Brand OEM/ODM
Transport Package Antistatic Package+Plastic Box and Carton Box
Specification Customized
Trademark Customized
Origin Shenzhen China
PCBA-Testing X-ray, Aoi
Processing Electrolytic Foil
SMT Capacity >2 Million Points/Day
DIP Capacity >100K Parts/Day
Certification RoHS, CCC, ISO
Min. Space of BGA +/- 0.3mm
Min.Pin Space of IC 0.3mm
Max.Precision of IC Assembly 0.03mm
Surface Finishing Lead-Free HASL
Number of Layers 4-10 Layer
Board Thickness 1.6mm

Product Description

Air Conditioning Circuit Board PCBA Amplifier Assembly Smart Home Custom PCB Assembly Files and Requirment for PCB,PCBA quotation: A BOM (Bill of Materials) with reference designators: component description, manufacturer's name and part number. PCB Gerber files. A PCB fabrication drawing and ...

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Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Self Service KIOSK
Management System Certification ISO9001:2015
Address 1/F & 7/F, Phenix Technology Building, Phenix?Community, Baoan District, 518103, Shenzhen, Guangdong, China
ODM Service Available Yes
OEM Service Available Yes

PCB Assembly Comparison

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Transaction Info
	Air Conditioning Circuit Board PCBA Amplifier Assembly Smart Home Custom PCB Assembly Contact Now	Quick View Premium Custom PCB Assembly Services for Electronic Devices Contact Now	Quick View High-Performance Rigid-Flex HDI PCB Board 94V-0 RoHS Certified Contact Now	Quick View High-Quality Gold Finger PCB Manufacturing for Global Buyers Contact Now	Quick View Custom PCB Assembly Manufacturing Service and PCBA Assembly Factory SMT Components Supplier Multilayer PCB Contact Now
Price	US$0.78-22.31 / Piece	US$0.11-9.90 / Square Meter	US$0.11-9.90 / Square Meter	US$0.11-9.90 / Square Meter	US$0.11-9.90 / Square Meter
Min Order	10 Pieces	1 Square Meter	1 Square Meter	1 Square Meter	1 Square Meter
Payment Terms	T/T	T/T, LC, D/P, PayPal, Western Union, Small-amount payment	T/T, LC, D/P, PayPal, Western Union, Small-amount payment	T/T, LC, D/P, PayPal, Western Union, Small-amount payment	T/T, LC, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	RoHS, CCC, ISO	-	-	-	-
Management System Certification	ISO9001:2015	-	-	-	-
Trade Capacity
Export Markets	Domestic	East Asia(Japan/ South Korea), Domestic	East Asia(Japan/ South Korea), Domestic	East Asia(Japan/ South Korea), Domestic	East Asia(Japan/ South Korea), Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;
Supplier Name	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hemeilin Technology Co., Ltd.	Shenzhen Hemeilin Technology Co., Ltd.	Shenzhen Hemeilin Technology Co., Ltd.	Shenzhen Hemeilin Technology Co., Ltd.
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