^{<thead id="gpwd1"></thead>}

^{<blockquote id="gpwd1"></blockquote>}

Multi-Functional Machine

US$100,000.00-1,000,000.00 / Piece

Advanced Integrated Solidifying Machine for Multi-Functional Die Bonding pictures & photos

Recommend for you
What is High Precision Automatic Die Bonding Machine for Semiconductors
What is Precision Wire Bonder for Power Devices and Innovative Packaging
What is High Precision Fully Automatic PCB Laser Marking Equipment

What is Advanced Integrated Solidifying Machine for Multi-Functional Die Bonding

Name: Advanced Integrated Solidifying Machine for Multi-Functional Die Bonding
Uploaded: 2026-01-09T21:57:25+08:00
Description: Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond &

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$100,000.00-1,000,000.00 / Piece

Sepcifications

After-sales Service Provided
Condition New
Speed High Speed
Precision High Precision
Certification ISO
Warranty 12 Months
Automatic Grade Automatic
Transport Package Customized or Wooden Box Packaging
Specification Standard Specifications
Trademark Himalaya
Origin China
Product Name Semiconductor Equipment
Feature 1 Guaranteed Quality
Feature 2 Customized According to Needs
After-Sale Service Provided

Product Description

Product Description Clip Bonder High-speed Clip Bonding System placement accuracy: ±50µm @3σ, theta placement accuracy: ±3°@3σ; Up to 20Clips / Cycle; Prebond &Posbond function; Solder patch &solder paste inspection function; High precision linear ...

Learn More

Jiangsu Himalaya Semiconductor Co., Ltd.

Gold Member Since 2023

Audited Supplier

Main Products Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, ...
Year of Establishment 2019-09-12
Repeat Buyers Choice 80%~100%
Address Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital 100,000,000 RMB
Main Markets Europe

Multi-Functional Machine Comparison

	Advanced Integrated Solidifying Machine for Multi-Functional Die Bonding Contact Now	Quick View High-Speed Intelligent Modula Multifunctional Model Machine SMT PCB Making Machine Contact Now	Quick View SMT Siemens 1035 Nozzle Siemens Nozzle for Pick and Place Machine SMT Nozzle High Quality Nozzle SMT Spare Parts Nozzle Contact Now	Quick View Juki Machine Automatic PCB SMT Contact Now	Quick View SMT Siemens 1033 Nozzle Siemens Nozzle for Pick and Place Machine SMT Nozzle High Quality Nozzle SMT Spare Parts Nozzle Contact Now

Transaction Info
	Advanced Integrated Solidifying Machine for Multi-Functional Die Bonding Contact Now	Quick View High-Speed Intelligent Modula Multifunctional Model Machine SMT PCB Making Machine Contact Now	Quick View SMT Siemens 1035 Nozzle Siemens Nozzle for Pick and Place Machine SMT Nozzle High Quality Nozzle SMT Spare Parts Nozzle Contact Now	Quick View Juki Machine Automatic PCB SMT Contact Now	Quick View SMT Siemens 1033 Nozzle Siemens Nozzle for Pick and Place Machine SMT Nozzle High Quality Nozzle SMT Spare Parts Nozzle Contact Now
Price	US$100,000.00-1,000,000.00 / Piece	US$63,000.00 / Piece	US$18.00-25.00 / Piece	US$63,000.00 / Piece	US$18.00-25.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union	T/T, D/P, PayPal, Western Union, LC	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	T/T, D/P, PayPal, Western Union, LC	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	ISO	CE	CE	CE	CE
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	-	ODM, OEM	-	ODM, OEM
Average Lead Time	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Support; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Weight: 1700kg; Product Size: 0201~74mm; Power Supply: Three-Phase AC200~415V; Maximum Height of Components: 25mm;	Condition: New; Warranty: 6 Months; Automatic Grade: Automatic; Brand: Wenzhan; Model: Siemens 1035 Nozzle; Quality: High Quality; MOQ: 1 PCS; Delivery: DHL, UPS ,FedEx You Order; Package: Caton Box;	After-sales Service: Support; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Weight: 1700kg; Product Size: 0201~74mm; Power Supply: Three-Phase AC200~415V; Maximum Height of Components: 25mm;	Condition: New; Warranty: 6 Months; Automatic Grade: Automatic; Brand: Wenzhan; Model: Siemens 1033 Nozzle; Quality: High Quality; MOQ: 1 PCS; Delivery: DHL, UPS ,FedEx You Order; Package: Caton Box;
Supplier Name	Jiangsu Himalaya Semiconductor Co., Ltd.	Shenzhen BOYU Electronic Technology Co., Ltd	Shenzhen Tuoxing Electromechanical Equipment Co., Ltd.	Shenzhen BOYU Electronic Technology Co., Ltd	Shenzhen Tuoxing Electromechanical Equipment Co., Ltd.
Select All

Contact Now

Hot Search