^{<thead id="gpwd1"></thead>}

^{<blockquote id="gpwd1"></blockquote>}

Precision Bonder

US$70,000.00-100,000.00 / Piece

Precision Wire Bonder for Power Devices and Innovative Packaging pictures & photos

Recommend for you
What is High Precision Automatic Die Bonding Machine for Semiconductors
What is High-Speed LED Wafer Die Bonder for Semiconductor Manufacturing
What is High Precision Fully Automatic PCB Laser Marking Equipment

What is Precision Wire Bonder for Power Devices and Innovative Packaging

Name: Precision Wire Bonder for Power Devices and Innovative Packaging
Uploaded: 2026-01-07T21:55:45+08:00
Description: Product Description Our advanced automated wire bonder is engineered for high-speed, high-reliability interconnections in semiconductor packaging. It features a robust long-gantry motion system with a

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$70,000.00-100,000.00 / Piece

Sepcifications

After-sales Service 7*24 Hours
Condition New
Speed High Speed
Precision Precision
Certification ISO
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Crate
Specification 960mm (L) x 1400mm (W) x 1700mm (H)
Trademark Himalaya
Origin China
Wire Cutter Front Cut / Rear Cut
Wire Feed System Motorized with High Resolution Encoder Feedback
Wire Loss Detection Encoder and Bond Power Detection Method
Maximum Wire Length Tracking Real-Time Monitoring
Bond Force Aluminum Wire: 50g - 1500g
Power Supply 200-240V AC, 50-60 Hz, 2000W
Weight 900 Kg
Work Area X Axis: 300 mm
Y Axis 300 mm

Product Description

Product Description Our advanced automated wire bonder is engineered for high-speed, high-reliability interconnections in semiconductor packaging. It features a robust long-gantry motion system with a spacious 300mm x 300mm work area, providing exceptional positioning accuracy of ±1µm ...

Learn More

Jiangsu Himalaya Semiconductor Co., Ltd.

Gold Member Since 2023

Audited Supplier

Main Products Die Bonder, Wire Bonding, Laser Marking(ID IC Wafer), Laser Grooving, Laser Cutting, ...
Year of Establishment 2019-09-12
Repeat Buyers Choice 80%~100%
Address Room 146, Office 3, No. 7, Sufu, Qianfeng Village, Mudu, Wuzhong District, Suzhou, Jiangsu, China
Registered Capital 100,000,000 RMB
Main Markets Europe

Precision Bonder Comparison

	Precision Wire Bonder for Power Devices and Innovative Packaging Contact Now	Quick View Juki Rx-8 Original Brand Minimally Used Hot Pick and Place Machine for Sale Contact Now	Quick View Juki Rx-8 Advanced High-Speed Newest for SMT Pick and Place Equipment Contact Now	Quick View Juki Rx-8 Innovative Fast-Speed and User-Friendly for Producing PCB Pick and Place Machine Contact Now	Quick View SMT Samsung Hanwha Control Board Card for Cp40 Pick and Place Machine Contact Now

Transaction Info
	Precision Wire Bonder for Power Devices and Innovative Packaging Contact Now	Quick View Juki Rx-8 Original Brand Minimally Used Hot Pick and Place Machine for Sale Contact Now	Quick View Juki Rx-8 Advanced High-Speed Newest for SMT Pick and Place Equipment Contact Now	Quick View Juki Rx-8 Innovative Fast-Speed and User-Friendly for Producing PCB Pick and Place Machine Contact Now	Quick View SMT Samsung Hanwha Control Board Card for Cp40 Pick and Place Machine Contact Now
Price	US$70,000.00-100,000.00 / Piece	US$70,000.00 / Piece	US$70,000.00 / Piece	US$70,000.00 / Piece	US$180.00-230.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, PayPal, Western Union	T/T	T/T	T/T	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	ISO	RoHS, ISO, CE	RoHS, ISO, CE	RoHS, ISO, CE	CCC, PSE, ISO, CE
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	Europe	Europe, Southeast Asia/ Mideast, Australia	Europe, Southeast Asia/ Mideast, Australia	Europe, Southeast Asia/ Mideast, Australia	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification	After-sales Service: 724 Hours;* Condition: New; Speed: High Speed; Precision: Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Wire Cutter: Front Cut / Rear Cut; Wire Feed System: Motorized with High Resolution Encoder Feedback; Wire Loss Detection: Encoder and Bond Power Detection Method; Maximum Wire Length Tracking: Real-Time Monitoring; Bond Force: Aluminum Wire: 50g - 1500g; Power Supply: 200-240V AC, 50-60 Hz, 2000W; Weight: 900 Kg; Work Area: X Axis: 300 mm; Y Axis: 300 mm;	After-sales Service: on Site Installation; Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Placement Speed: 100,000cph; Feeder Capacity: Upto 56; Component Height: 3mm;	After-sales Service: on Site Installation; Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Placement Speed: 100,000cph; Feeder Capacity: Upto 56; Placement Accuracy: ±0.04mm (Cpk ≧1); Component Height: 3mm;	After-sales Service: on Site Installation; Condition: New; Speed: Super High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Placement Speed: 100,000cph; Feeder Capacity: Upto 56; Placement Accuracy: ±0.04mm (Cpk ≧1); Component Height: 3mm;	After-sales Service: Technical Support; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Quality: 100% Tested; Delivery: UPS/DHL/TNT/FedEx; Express: by Air/Sea/Land; Lead Time: 3 Days;
Supplier Name	Jiangsu Himalaya Semiconductor Co., Ltd.	Shenzhen Chengyuan Industrial Automation Equipment Co., Ltd.	Shenzhen Chengyuan Industrial Automation Equipment Co., Ltd.	Shenzhen Chengyuan Industrial Automation Equipment Co., Ltd.	Shenzhen Tuoxing Electromechanical Equipment Co., Ltd.
Select All

Contact Now

Hot Search