Electronics Motherboard

US$2.48-6.85 / Piece

High Frequency Multilayer Circuit Board Electronic PCB Assembly Manufacturer's Product-High Quality PCB & PCBA pictures & photos

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What is High Frequency Multilayer Circuit Board Electronic PCB Assembly Manufacturer's Product-High Quality PCB & PCBA

Name: High Frequency Multilayer Circuit Board Electronic PCB Assembly Manufacturer's Product-High Quality PCB & PCBA
Uploaded: 2025-12-21T18:52:51+08:00
Description: Custom Multilayer PCB Board Manufacturer | High Precision FR4 Rogers PCB Assembly OEM China Supplier Fastline could produce 1-26 layers PCB board for electronic products. providing PCB design, PCB fa

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About this Item

Price

Purchase Qty. Reference FOB Price

50-499 Pieces US$6.85

500-1,999 Pieces US$4.28

2,000+ Pieces US$2.48

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V2
Mechanical Rigid Rigid
Processing Technology Delay Pressure Foil
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Vacuum+Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark FL
Origin Shenzhen, China
Conductive Type Unipolar Integrated Circuit
Integration Ulsi
Technics Thick Film IC
Regular Board Thickness 1.6mm
Board Material Fr4, Bt HDI Material
Board Layer 4 Layers
Surface Finihsing HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP
Copper Thickness 1 Oz
Thickness of Copper Foil Wire 8-240 Um(4oz)
Min. Hole Size 0.075mm(3mil)
Min Pad +/- 0.1mm (4mil)
Min Board Thickness 0.1mm Only for Single and Double Sided
Min. Line Width/Space 0.05mm (2mil)
Outline Machining Accuracy +/- 0.1mm (4mil)
MOQ 1PCS

Product Description

Custom Multilayer PCB Board Manufacturer | High Precision FR4 Rogers PCB Assembly OEM China Supplier Fastline could produce 1-26 layers PCB board for electronic products. providing PCB design, PCB fabrication, PCB clone, and PCB assembly services. and we have got the UL, ISO, SGS certifications. ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

Electronics Motherboard Comparison

	High Frequency Multilayer Circuit Board Electronic PCB Assembly Manufacturer's Product-High Quality PCB & PCBA Contact Now	Quick View 4 Layer PCB Printed Circuit Board with High Quality and Good Price Made in Shenzhen Contact Now	Quick View 94V0 RoHS PCB Board Making, Electronic PCB Board Contact Now	Quick View Multilayer Rigid PCB Printed Circuit Boards Made of 94V0 Fr4 with Immersion Gold in Blue Ink Contact Now	Quick View Supplying Cem1 Fr4 High Tg Rogers Iteq PCB PCBA Contact Now

Transaction Info
	High Frequency Multilayer Circuit Board Electronic PCB Assembly Manufacturer's Product-High Quality PCB & PCBA Contact Now	Quick View 4 Layer PCB Printed Circuit Board with High Quality and Good Price Made in Shenzhen Contact Now	Quick View 94V0 RoHS PCB Board Making, Electronic PCB Board Contact Now	Quick View Multilayer Rigid PCB Printed Circuit Boards Made of 94V0 Fr4 with Immersion Gold in Blue Ink Contact Now	Quick View Supplying Cem1 Fr4 High Tg Rogers Iteq PCB PCBA Contact Now
Price	US$2.48-6.85 / Piece	US$0.10-10.00 / piece	US$0.10-80.00 / Piece	US$0.01-10.00 / piece	US$0.01-150.00 / Piece
Min Order	50 Pieces	1 piece	1 Piece	1 piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Product Certification	-	-	UL,ISO9001&ISO14001,SGS,RoHS Report	-	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Conductive Type: Unipolar Integrated Circuit; Integration: Ulsi; Technics: Thick Film IC; Regular Board Thickness: 1.6mm; Board Material: Fr4, Bt HDI Material; Board Layer: 4 Layers; Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP; Copper Thickness: 1 Oz; Thickness of Copper Foil Wire: 8-240 Um(4oz); Min. Hole Size: 0.075mm(3mil); Min Pad: +/- 0.1mm (4mil); Min Board Thickness: 0.1mm Only for Single and Double Sided; Min. Line Width/Space: 0.05mm (2mil); Outline Machining Accuracy: +/- 0.1mm (4mil); MOQ: 1PCS;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.6mm; Copper Thickness: 35 Um; Surface Finish: Enig; Solder Mask: Green; Legend: White;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Layers: 1-20layers;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Layers: 8; Board Thickness: 1.6mm; Inner Copper: 35um; Outer Copper: 35um; Surface Finish: Enig; Solder Mask: Blue; Legend: White; Mini Holes: 0.1mm; Mini Line Width: 0.1mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Kb-6160-6160A-6160; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Kb-6160-6160A-6160; Insulation Materials: Epoxy Resin; Brand: Abis; Layer: 4; Cooper: 1; Thickness: 1.5; Mask: Orange;
Supplier Name	Fastline Circuits Co., Limited	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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