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      BGA PCB
      US$0.16-0.26 / Piece
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      What is BGA Multilayer PCB Circuit Board with High Precision, Long-Term Support Service

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-999 Pieces US$0.26

      1,000-4,999 Pieces US$0.23

      5,000-9,999 Pieces US$0.19

      10,000+ Pieces US$0.16

      Sepcifications

      • Type Combining Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Medical Instruments
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Delay Pressure Foil
      • Base Material Fr4
      • Insulation Materials Epoxy Resin
      • Transport Package Vacuum+Carton Packing
      • Specification RoHS, ISO9001, UL, SGS
      • Trademark FL
      • Origin Shenzhen, China
      • Board Thickness 1.6mm
      • Board Layer 4 Layers
      • Copper Thickness 1 Oz
      • Solder Mask Green+Yellow
      • Silksreen White+Black
      • Surface Finihsing HASL
      • Lead Time 6-8 Working Days
      • Shipping Type DHL.TNT, EMS, FedEx, UPS etc
      • PCB Design Custom Design Product
      • Board Material Fr4

      Product Description

      BGA Multilayer PCB Circuit Board with high precision, long-term support service Fastline Circuits is capable of providing full turnkey and partial turnkey printed circuit board assembly services. For full turnkey, we take care of the entire process, including preparatio n of Printed Circuit ...

      Learn More

      BGA PCB Comparison
      Transaction Info
      Price US$0.16-0.26 / Piece US$1.00 / Piece US$1.00 / Piece US$1.00 / Piece US$1.00 / Piece
      Min Order 1 Piece 1,000 Pieces 1,000 Pieces 1,000 Pieces 1,000 Pieces
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, Western Union LC, T/T, Western Union LC, T/T, Western Union LC, T/T, Western Union
      Quality Control
      Product Certification - RoHS RoHS RoHS RoHS
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa South America, Europe, Africa
      Annual Export Revenue - - - - -
      Business Model - OEM OEM OEM OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Medical Instruments;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Thickness: 1.6mm;
      Board Layer: 4 Layers;
      Copper Thickness: 1 Oz;
      Solder Mask: Green+Yellow;
      Silksreen: White+Black;
      Surface Finihsing: HASL;
      Lead Time: 6-8 Working Days;
      Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
      PCB Design: Custom Design Product;
      Board Material: Fr4;
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Sum;
      PCB Layer: 2-4 Layers;
      Baser Material: Fr4;
      Board Thickness: 1mm;
      Copper Thickness: 0.35mm;
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Sum;
      PCB Layer: 2-4 Layers;
      Baser Material: Fr4;
      Board Thickness: 1mm;
      Copper Thickness: 0.35mm;
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Sum;
      PCB Layer: 2-4 Layers;
      Baser Material: Fr4;
      Board Thickness: 1mm;
      Copper Thickness: 0.35mm;
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Sum;
      PCB Layer: 2-4 Layers;
      Baser Material: Fr4;
      Board Thickness: 1mm;
      Copper Thickness: 0.35mm;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Yueqing Page Electrical Co., Ltd.

      Gold Member Audited Supplier

      Yueqing Page Electrical Co., Ltd.

      Gold Member Audited Supplier

      Yueqing Page Electrical Co., Ltd.

      Gold Member Audited Supplier

      Yueqing Page Electrical Co., Ltd.

      Gold Member Audited Supplier

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