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      Centralized Cold Junction Buffer
      US$0.50-0.69 / Piece
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      What is Centralized Cold Junction Buffer for Multi-Channel Thermocouples PCB with Low-Drift Unity-Gain Amplifier and Shielded Sensor Input Stage

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-999 Pieces US$0.69

      1,000-4,999 Pieces US$0.62

      5,000-9,999 Pieces US$0.56

      10,000+ Pieces US$0.50

      Sepcifications

      • Structure Multilayer FPC
      • Material Polyimide
      • Combination Mode Without Adhesive Flexible Plate
      • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
      • Conductive Adhesive Conductive Silver Paste
      • Flame Retardant Properties HB
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Metal Composite Materials
      • Brand Fastline
      • Transport Package Vacuum+Carton Packing
      • Specification UL, SGS, ROHS
      • Trademark FL
      • Origin China
      • Board Material Polyimide
      • Board Thickness 1.6 mm
      • Copper Thickness 1 Oz (35um)
      • Surface Treatment HASL Lead Free
      • Service High Quality
      • Lead Time 5-10 Days
      • Small Order Accepted
      • Test 100% Test
      • PCB Type Rigid-Flexible PCB
      • Silk Screen White

      Product Description

      Fr4 Rigid and Flexible Circuit Board Professional PCB/ PCBA Factory Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb catalog below: ...

      Learn More

      Centralized Cold Junction Buffer Comparison
      Transaction Info
      Price US$0.50-0.69 / Piece US$0.18-0.30 / Piece US$0.18-0.30 / Piece US$0.18-0.30 / Piece US$0.18-0.30 / Piece
      Min Order 1 Piece 5 Pieces 5 Pieces 5 Pieces 5 Pieces
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
      Quality Control
      Product Certification - Ohsas18001:2007,ISO14001:2004,ISO/Ts16949:2009 ISO Ohsas18001:2007,ISO14001:2004,ISO/Ts16949:2009 ISO Ohsas18001:2007,ISO14001:2004,ISO/Ts16949:2009 ISO Ohsas18001:2007,ISO14001:2004,ISO/Ts16949:2009 ISO
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Without Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: HB;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Fastline;
      Board Material: Polyimide;
      Board Thickness: 1.6 mm;
      Copper Thickness: 1 Oz (35um);
      Surface Treatment: HASL Lead Free;
      Service: High Quality;
      Lead Time: 5-10 Days;
      Small Order: Accepted;
      Test: 100% Test;
      PCB Type: Rigid-Flexible PCB;
      Silk Screen: White;
      Structure: Multilayer FPC;
      Material: Polyester Film;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Color: Customized;
      Feature: Enclosed and Waterproof Can Used at Any Environmen;
      Structure: Multilayer FPC;
      Material: Polyester Film;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Color: Customized;
      Feature: Enclosed and Waterproof Can Used at Any Environmen;
      Structure: Multilayer FPC;
      Material: Polyester Film;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Color: Customized;
      Feature: Enclosed and Waterproof Can Used at Any Environmen;
      Structure: Multilayer FPC;
      Material: Polyester Film;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Color: Customized;
      Feature: Enclosed and Waterproof Can Used at Any Environmen;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Shenzhen Yizexin Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Yizexin Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Yizexin Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Yizexin Technology Co., Ltd.

      Diamond Member Audited Supplier