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      Flexible PCB
      US$0.43-0.57 / Piece
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      What is FPC Manufacturer Flexible Circuit Board Customized Camera Flexible PCB Polyimide Assembly Production Flex PCB

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-999 Pieces US$0.57

      1,000-4,999 Pieces US$0.52

      5,000+ Pieces US$0.43

      Sepcifications

      • Structure Double-Sided FPC
      • Material Polyimide
      • Combination Mode Adhesive Flexible Plate
      • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
      • Conductive Adhesive Conductive Silver Paste
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Base Material Polyimide
      • Insulation Materials Epoxy Resin
      • Transport Package Vacuum +Carton Packing
      • Specification RoHS, ISO9001, UL, SGS
      • Trademark FL
      • Origin Shenzhen, China
      • Board Material Polyimide
      • Board Layer 2
      • Board Thickness 0.1 mm
      • Copper Thickness 1 Oz
      • Solser Mask Yellow
      • Silkscreen White
      • Surface Finishing Enig
      • Lead Time 4-5 Working Days
      • Shipping Type DHL.TNT, EMS, FedEx, UPS etc
      • PCB Prototype Product

      Product Description

      FPC Manufacturer Flexible Circuit Board Customized Camera Flexible PCB Polyimide Assembly Production Flex PCB Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS ...

      Learn More

      Flexible PCB Comparison
      Transaction Info
      Price US$0.43-0.57 / Piece US$0.38 / Piece US$0.38 / Piece US$0.38 / Piece US$0.50-5.00 / pieces
      Min Order 1 Piece 5 Pieces 5 Pieces 5 Pieces 5 pieces
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T T/T T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Management System Certification - ISO9001:2015, ISO14001 ISO9001:2015, ISO14001 ISO9001:2015, ISO14001 -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM, OEM ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: one month
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: one month
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Double-Sided FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Polyimide;
      Insulation Materials: Epoxy Resin;
      Board Material: Polyimide;
      Board Layer: 2;
      Board Thickness: 0.1 mm;
      Copper Thickness: 1 Oz;
      Solser Mask: Yellow;
      Silkscreen: White;
      Surface Finishing: Enig;
      Lead Time: 4-5 Working Days;
      Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
      PCB: Prototype Product;
      Structure: Single-Sided FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Door Lock;
      Conductive Adhesive: Anisotropic Conductive Adhesive;
      Flame Retardant Properties: V0;
      Processing Technology: Etching;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Snt;
      Size: Customizable;
      Thickness: 0.08-0.32mm;
      Tensile Strength: ≥200 MPa;
      Working Temp.: -269℃~+250℃;
      Feature 1: Chemical Resistance;
      Feature 2: Oil-Resistant;
      Structure: Single-Sided FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Door Lock;
      Conductive Adhesive: Anisotropic Conductive Adhesive;
      Flame Retardant Properties: V0;
      Processing Technology: Etching;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Snt;
      Size: Customizable;
      Thickness: 0.08-0.32mm;
      Tensile Strength: ≥200 MPa;
      Working Temp.: -269℃~+250℃;
      Feature 1: Chemical Resistance;
      Feature 2: Oil-Resistant;
      Structure: Double-Sided FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace, Membrane Switch;
      Conductive Adhesive: Anisotropic Conductive Adhesive;
      Flame Retardant Properties: V0;
      Processing Technology: Etching;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Snt;
      Size: Customizable;
      Thickness: 0.08-0.32mm;
      Tensile Strength: ≥200 MPa;
      Working Temp.: -269℃~+250℃;
      Feature: Chemical Resistance;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Delay Pressure Foil;
      Base Material: Pi;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Supplier Type: Manufacturer;
      Copper Thickness: 0.5oz;
      Min. Hole Size: 0.15mm;
      Min. Line Width: 0.075mm;
      Surface Finishing: Enig, Immersion Silver, OSP;
      Stiffener: Without, Top, Bot, Both Sides;
      Solder Mask(Coverlay): Yellow, White, Black;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      SNT Electronics Technology Co., Ltd.

      Diamond Member Audited Supplier

      SNT Electronics Technology Co., Ltd.

      Diamond Member Audited Supplier

      SNT Electronics Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

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