Flex PCB Design

US$0.43-0.57 / Piece

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What is Customized Flex PCB Design and FPCB Manufacturing

Name: Customized Flex PCB Design and FPCB Manufacturing
Uploaded: 2026-03-24T01:48:22+08:00
Description: Product Description Standard Flex Materials: Polyimide (Kapton) 0.5 mil to 5 mils (.012mm - .127mm) Adhesiveless Copper Clad Base Material 1 mil to 5 mils Flame Retardant Laminate, Base Material,

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Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.57

1,000-4,999 Pieces US$0.52

5,000+ Pieces US$0.43

Sepcifications

Structure Double-Sided FPC
Material Polyimide
Combination Mode Adhesive Flexible Plate
Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive Conductive Silver Paste
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Base Material Polyimide
Insulation Materials Epoxy Resin
Transport Package Vacuum +Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark FL
Origin Shenzhen, China
Board Material Polyimide
Board Layer 2
Board Thickness 0.1 mm
Copper Thickness 1 Oz
Stiffener 0.4mm Fr4
Solser Mask Yellow
Silkscreen White
Surface Finishing Enig
Lead Time 4-5 Working Days
PCB Design Custom Design Product

Product Description

Product Description Standard Flex Materials: Polyimide (Kapton) 0.5 mil to 5 mils (.012mm - .127mm) Adhesiveless Copper Clad Base Material 1 mil to 5 mils Flame Retardant Laminate, Base Material, and Coverlay High Performance Epoxy Laminate and Prepreg High Performance Polyimide Laminate ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

Flex PCB Design Comparison

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Transaction Info
	Customized Flex PCB Design and FPCB Manufacturing Contact Now	Quick View Consumer Electronics Products Printed PCB Rigid Flex Circuit Board Contact Now	Quick View Flexible PCB Circuit Board Flex PCB Board for Auto LED/LCD Lighting PCB Board PCBA Assembly FPC Manufacturer for Electronics Contact Now	Quick View Computer with LCD Screen Multilayer Board Flexible PCB FPC Contact Now	Quick View Double Side Flexible Printed Circuit Board FPC Made of Polyimide with Immersion Gold Contact Now
Price	US$0.43-0.57 / Piece	US$0.10-100.00 / Piece	US$0.10-80.00 / Piece	US$0.10-80.00 / Piece	US$0.10-10.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Product Certification	-	UL,ISO9001&ISO14001,SGS,RoHS,Ts16949	UL,ISO9001&ISO14001,SGS,RoHS,Ts16949	UL,ISO9001&ISO14001,SGS,RoHS,Ts16949	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Double-Sided FPC; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Polyimide; Insulation Materials: Epoxy Resin; Board Material: Polyimide; Board Layer: 2; Board Thickness: 0.1 mm; Copper Thickness: 1 Oz; Stiffener: 0.4mm Fr4; Solser Mask: Yellow; Silkscreen: White; Surface Finishing: Enig; Lead Time: 4-5 Working Days; PCB Design: Custom Design Product;	Structure: Multilayer FPC; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Special Process: Stiffeners etc; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Enig Thickness: 1-3u''; Copper Thickness: 0.5-8oz; Hard Gold Thickness: 5-50u'';	Structure: Multilayer FPC; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Special Process: Stiffeners etc; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Enig Thickness: 1-3u''; Copper Weight: 0.5-8oz; Hard Gold Thickness: 5-50u'';	Structure: Multilayer FPC; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Special Process: Stiffeners etc; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Enig Thickness: 1-3u''; Copper Thickness: 0.5-8oz; Hard Gold Thickness: 5-50u'';	Structure: Double-Sided FPC; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Application: Digital Products; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Layers: 2; Copper Thick: 35um; Surface Finish: Enig; Solder Mask: Coverlay;
Supplier Name	Fastline Circuits Co., Limited	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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