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      PCB Board
      US$2.68-4.34 / Piece
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      What is Ultra-Thin Flexible PCB for Foldable Phones and Dynamic Flexing Applications 25μm Pi Thickness Over 200, 000 Flex Cycles High Reliability

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$2.68-4.34 / Piece

      Sepcifications

      • Structure Multilayer FPC
      • Material Polyimide
      • Combination Mode Without Adhesive Flexible Plate
      • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
      • Conductive Adhesive Conductive Silver Paste
      • Flame Retardant Properties V1
      • Processing Technology Delay Pressure Foil
      • Base Material Aluminum
      • Insulation Materials Organic Resin
      • Brand Customized
      • Transport Package Vacuum+Carton Packing
      • Specification UL, SGS, ROHS
      • Trademark FL
      • Origin China
      • Board Material Polyimide
      • Board Thickness 1.6 mm
      • Copper Thickness 1 Oz (35um)
      • Surface Treatment HASL Lead Free

      Product Description

      Product Description Commodity Introduction This is a type of polyimide PCB for the application of Sensor. It's a single sided layer board at 0.1mm thick. The base laminate is from ITEQ, Solder mask and silkscreen from Taiyo. It's fabricated per IPC 6012 Class 2 using supplied Gerber data. Each ...

      Learn More

      PCB Board Comparison
      Transaction Info
      Price US$2.68-4.34 / Piece US$2.89 / Piece US$2.89 / Piece US$2.89 / Piece US$2.89 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast Southeast Asia/ Mideast Southeast Asia/ Mideast Southeast Asia/ Mideast Southeast Asia/ Mideast
      Annual Export Revenue - - - - -
      Business Model - Own Brand Own Brand Own Brand Own Brand
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Without Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V1;
      Processing Technology: Delay Pressure Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: Customized;
      Board Material: Polyimide;
      Board Thickness: 1.6 mm;
      Copper Thickness: 1 Oz (35um);
      Surface Treatment: HASL Lead Free;
      Structure: Multilayer FPC;
      Material: Pi;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Cry;
      Structure: Multilayer FPC;
      Material: Pi;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Cry;
      Structure: Multilayer FPC;
      Material: Pi;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Cry;
      Structure: Multilayer FPC;
      Material: Pi;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Cry;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Shenzhen Chengruyuan Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Chengruyuan Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Chengruyuan Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Chengruyuan Technology Co., Ltd.

      Diamond Member Audited Supplier

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