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      High-Speed FPC
      US$2.34-4.26 / Piece
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      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$2.34-4.26 / Piece

      Sepcifications

      • Structure Multilayer FPC
      • Material Fr4 + Polymide
      • Combination Mode Adhesive Flexible Plate
      • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
      • Conductive Adhesive Conductive Silver Paste
      • Flame Retardant Properties HB
      • Processing Technology Electrolytic Foil
      • Base Material Aluminum
      • Insulation Materials Organic Resin
      • Brand Customized
      • Transport Package Vacuum+Carton Packing
      • Specification RoHS, ISO9001, UL, SGS
      • Trademark Fastline
      • Origin Shenzhen, China
      • Board Thickness 1.6mm Rigid and 0.1mm Flex
      • Copper Thickness 1oz
      • Solder Mask Green and Yellow
      • Silk Screen White
      • PCB Type Rigid-Flexible PCB
      • Test 100% Test
      • Small Order Accepted
      • Lead Time 5-10 Days
      • Service High Quality

      Product Description

      Customized Rigid Flexible PCB Board Circuit Manufacturing Hi buyer, Thank your for scanning our Rigid-Flex PCB Products. As is known,PCB is customized product ,so the unit price is not real,details pls contact me and a quotation will be offered.Please send us PCB files in gerber files, ...

      Learn More

      High-Speed FPC Comparison
      Transaction Info
      Price US$2.34-4.26 / Piece US$0.20-1.00 / pieces US$0.20-1.20 / pieces US$0.50-5.00 / pieces US$0.20-1.20 / pieces
      Min Order 1 Piece 5 pieces 5 pieces 5 pieces 5 pieces
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Multilayer FPC;
      Material: Fr4 + Polymide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: HB;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: Customized;
      Board Thickness: 1.6mm Rigid and 0.1mm Flex;
      Copper Thickness: 1oz;
      Solder Mask: Green and Yellow;
      Silk Screen: White;
      PCB Type: Rigid-Flexible PCB;
      Test: 100% Test;
      Small Order: Accepted;
      Lead Time: 5-10 Days;
      Service: High Quality;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Delay Pressure Foil;
      Base Material: Pl, Copper and Ni/Au;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Supplier Type: Manufacturer;
      Copper Thickness: 0.5oz;
      Min. Hole Size: 0.15mm;
      Min. Line Spacing: 0.075mm;
      Min. Line Width: 0.075mm;
      Board Thickness: 0.057 to 0.6mm;
      Stiffener: Without, Top, Bot, Both Sides;
      Solder Mask(Coverlay): Yellow, White, Black;
      Surface Finishing: Enig, Immersion Silver, OSP;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Delay Pressure Foil;
      Base Material: Pi;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Supplier Type: Manufacturer;
      Copper Thickness: 0.5oz-3oz;
      Min. Hole Size: 0.15mm;
      Min.Line Width: 0.075mm;
      Min.Line Spacing: 0.075mm;
      Board Thickness: 0.057-0.6mm;
      Surface Finishing: Enig, Immersion Silver, OSP;
      Stiffener: Without, Top, Bot, Both Sides;
      Solder Mask(Coverlay): Yellow, White, Black;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Delay Pressure Foil;
      Base Material: Pl, Copper and Ni/Au;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Supplier Type: Manufacturer;
      Copper Thickness: 0.5oz;
      Min. Hole Size: 0.15mm;
      Min. Line Spacing: 0.075mm;
      Min. Line Width: 0.075mm;
      Stiffener: Without, Top, Bot, Both Sides;
      Solder Mask(Coverlay): Yellow, White, Black;
      Board Thickness: 0.057 to 0.6mm;
      Surface Finishing: Enig, Immersion Silver, OSP;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Delay Pressure Foil;
      Base Material: Pi;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Supplier Type: Manufacturer;
      Copper Thickness: 0.5oz-3oz;
      Min. Hole Size: 0.15mm;
      Board Thickness: 0.057-0.6mm;
      Min.Line Spacing: 0.075mm;
      Min. Line Width: 0.075mm;
      Surface Finishing: Enig, Immersion Silver, OSP;
      Stiffener: Without, Top, Bot, Both Sides;
      Solder Mask(Coverlay): Yellow, White, Black;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

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