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      PCB Board
      US$4.22-5.78 / Piece
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      What is Customized Quality Circuit Board Gold Finger with Competitive Price

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$4.22-5.78 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Communication
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Fr4
      • Insulation Materials Epoxy Resin
      • Transport Package Vacuum+Carton Packing
      • Specification RoHS, ISO9001, UL, SGS
      • Trademark FL
      • Origin Shenzhen, China
      • Board Material Fr4, Rogers
      • Board Layer 1-26
      • Board Thickness 0.8mm-3.0mm
      • Copper Thickness 0.5 Oz-6 Oz
      • Max PCB Size 650*650mm
      • Min Hole 0.15mm
      • Min Trace 0.15mm
      • Surface Finishing HASL-Lf
      • Solder Mask Any
      • Lead Time 4-5 Working Days

      Product Description

      Customized quality circuit board gold finger with competitive price Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb catalog below: ...

      Learn More

      PCB Board Comparison
      Transaction Info
      Price US$4.22-5.78 / Piece US$0.41 / Piece US$0.45 / Piece US$0.10 / Piece US$0.01-100.00 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment Small-amount payment, Western Union, PayPal, D/P, T/T, LC Small-amount payment, Western Union, PayPal, D/P, T/T, LC LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union
      Quality Control
      Product Certification - - - RoHS, UL, SGS, Ect -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM, OEM - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Material: Fr4, Rogers;
      Board Layer: 1-26;
      Board Thickness: 0.8mm-3.0mm;
      Copper Thickness: 0.5 Oz-6 Oz;
      Max PCB Size: 650*650mm;
      Min Hole: 0.15mm;
      Min Trace: 0.15mm;
      Surface Finishing: HASL-Lf;
      Solder Mask: Any;
      Lead Time: 4-5 Working Days;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Final Height of PCB: 1.6 mm ±0.16;
      Final Foil External: 1 Oz;
      Inner Copper Thick: 0.5 Oz;
      Surface Finish: Immersion Gold (22.1% );
      Solder Mask Color: Matt Blue, Ksm-6189blm1;
      Legend Color: White, Ijr-4000 MW300, Taiyo Brand;
      Impedance Control: 50 Ohm Coplanar Impedance;
      Minimum&#160;Trace&#160;and&#160;Space: 5.9 Mil / 5.0 Mil;
      Minimum&#160;/&#160;Maximum&#160;Holes: 0.8 mm / 3.85 mm;
      Test: 100% Electrical Test Prior Shipment;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Final Height of PCB: 1.6 mm ±0.16;
      Final Foil External: 1 Oz;
      Inner Copper Thick: 1 Oz;
      Surface Finish: HASL Lead Free;
      Solder Mask Color: Green, Psr-2000gt600d, Taiyo Brand;
      Legend Color: White, Ijr-4000 MW300, Taiyo Brand;
      Minimum&#160;Trace&#160;and&#160;Space: 10 Mil / 8 Mil;
      Minimum&#160;/&#160;Maximum&#160;Holes: 0.9 mm / 3.3 mm;
      Via: Minimum Size 0.9mm.;
      Test: 100% Electrical Test Prior Shipment;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Surface Finishing: HASL;
      Solder Mask: Green;
      Copper Thicknes: 1oz;
      Board Thickness: 1.6mm;
      Min. Hole Size: 0.25mm;
      Min. Line Wigth: 0.15mm;
      Min. Line Spacing: 0.15mm;
      Package: Vacuum;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Abis;
      Layer: 1-20 Layers;
      Raw Material: Fr-4, Cu Base, High Tg Fr-4, PTFE, Rogers, Teflon etc.;
      Board Thickness: 0.20mm-8.00mm;
      Board Outline Tolerance: +0.10mm;
      Thickness Tolerance(T≥0.8mm): +/-8%;
      Thickness Tolerance(T<0.8mm): +/-10%;
      Minimum Line/ Space: 0.075mm;
      Surface Finish/Treatment: HASL, Enig, Chem, Tin, Flash Gold, OSP, Gold Finger;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

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