| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Communication;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Final Height of PCB: 1.6 mm ±0.16;
Final Foil External: 1 Oz;
Inner Copper Thick: 1 Oz;
Surface Finish: HASL Lead Free;
Solder Mask Color: Green, Psr-2000gt600d, Taiyo Brand;
Legend Color: White, Ijr-4000 MW300, Taiyo Brand;
Minimum Trace and Space: 10 Mil / 8 Mil;
Minimum / Maximum Holes: 0.9 mm / 3.3 mm;
Via: Minimum Size 0.9mm.;
Test: 100% Electrical Test Prior Shipment;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Gold Finger;
Lead Time: 6-8 Working Days;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Abis;
Layer: 1-20 Layers;
Raw Material: Fr-4, Cu Base, High Tg Fr-4, PTFE, Rogers, Teflon etc.;
Board Thickness: 0.20mm-8.00mm;
Board Outline Tolerance: +0.10mm;
Thickness Tolerance(T≥0.8mm): +/-8%;
Thickness Tolerance(T<0.8mm): +/-10%;
Minimum Line/ Space: 0.075mm;
Surface Finish/Treatment: HASL, Enig, Chem, Tin, Flash Gold, OSP, Gold Finger;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil, Electrolytic Foil;
Base Material: Fr4, Copper;
Insulation Materials: Organic Resin;
Board Thickness: 1.6mm;
Board Layer: 8 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: HASL-Lf;
Lead Time: 6-8 Working Days;
MOQ: No;
Test: Aoi X-ray;
Service: Custom;
Package: Vacuum Packaging+Bubble Bag+Carton;
Function: Accept Customization;
File: PCB, Gerber File, Cam,;
Payment: T/T; Paypal; W.U.;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Board Thickness: 1.6mm;
Board Layer: 8 Layers;
Copper Thickness: 1 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
MOQ: No;
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