Multilayer PCB

US$0.10-15.00 / Piece

High Density Prototyping Circuit Board Multilayer Immersion Gold PCB Electronics Manufacturing pictures & photos

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What is High Density Prototyping Circuit Board Multilayer Immersion Gold PCB Electronics Manufacturing

Name: High Density Prototyping Circuit Board Multilayer Immersion Gold PCB Electronics Manufacturing
Uploaded: 2025-12-20T06:41:35+08:00
Description: Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and p

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-15.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Exceeding
Transport Package Vacuum
Specification Customized
Trademark EEG
Origin Shenzhen
Certification RoHS, UL CE, GS, ISO
Delivery 24hours~5 Days
Service 7*24 Hours Online
Price Factory Price
Keyword Custom PCB
MOQ 1 PCS
Min. Line Spacing 0.075mm(3mil)
Copper Thickness 18um-3500um(0.5- 100oz)
Min. Line Width 0.075mm(3mil)
Min Hole Size 0.1mm(4mil)
Testing Service 100% E-Testing
Board Thickness 0.2-6.0mm
Industrial Industrial Control Board, Motherboard
Surface Finishing Immersion Gold/Silver, Tin, HASL Lf, Gold Finger, OSP
Solder Mask Green, White, Black, Blue, Red(Customized)

Product Description

Founded in 2001,Exceeding Electronics Group Ltd,provides world-class customer support services. We are an industry lead in automotive, telecommunications, computer, industrial control, medical and power and energy PCB. Buyers from international markets choose to source from us because of our ...

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EXCEEDING ELECTRONICS GROUP LIMITED

Diamond Member Since 2021

Audited Supplier

Rating & Reviews: 4.0/5.0

(1 Reviews)

Main Products PCB FPC PCB Assembly LED PCB Aluminum PCB HDI, High Frequency Board, High Frequency PCB
Address Rm1107, Building3, Wisdom Field, Biguiyuan, Xingyiroad, Fuyong Street, Baoan Discrict, Shenzhen City.
Main Markets North America, South America, Western Europe
International Commercial Terms(Incoterms) FOB, CFR, CIF, DDP, DAP, EXW
Terms of Payment T/T, PayPal, Western Union, Small-amount payment, VTB
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

Multilayer PCB Comparison

	High Density Prototyping Circuit Board Multilayer Immersion Gold PCB Electronics Manufacturing Contact Now	Buried Via PCB Built on 6 Layer with Blind Via and in Panel Contact Now	Buried Via PCB Built on 8 Layer with Impedance Control and RoHS Compliance Contact Now	Buried Via PCB Built on 10 Layer with CNC Routing and Black Mask Contact Now	Buried Via PCB Built on 12 Layer with Screen Printed Component Legends Contact Now

Transaction Info
	High Density Prototyping Circuit Board Multilayer Immersion Gold PCB Electronics Manufacturing Contact Now	Buried Via PCB Built on 6 Layer with Blind Via and in Panel Contact Now	Buried Via PCB Built on 8 Layer with Impedance Control and RoHS Compliance Contact Now	Buried Via PCB Built on 10 Layer with CNC Routing and Black Mask Contact Now	Buried Via PCB Built on 12 Layer with Screen Printed Component Legends Contact Now
Price	US$0.10-15.00 / Piece	US$9.99 / Piece	US$9.99 / Piece	US$9.99 / Piece	US$9.99 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, PayPal, Western Union, Small-amount payment, VTB	Small-amount payment, Western Union, PayPal, D/P, T/T, LC	Small-amount payment, Western Union, PayPal, D/P, T/T, LC	Small-amount payment, Western Union, PayPal, D/P, T/T, LC	Small-amount payment, Western Union, PayPal, D/P, T/T, LC
Quality Control
Product Certification	RoHS, UL CE, GS, ISO	-	-	-	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Exceeding; Delivery: 24hours~5 Days; Service: 724 Hours Online;* Price: Factory Price; Keyword: Custom PCB; MOQ: 1 PCS; Min. Line Spacing: 0.075mm(3mil); Copper Thickness: 18um-3500um(0.5- 100oz); Min. Line Width: 0.075mm(3mil); Min Hole Size: 0.1mm(4mil); Testing Service: 100% E-Testing; Board Thickness: 0.2-6.0mm; Industrial: Industrial Control Board, Motherboard; Surface Finishing: Immersion Gold/Silver, Tin, HASL Lf, Gold Finger, OSP; Solder Mask: Green, White, Black, Blue, Red(Customized);	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;
Supplier Name	EXCEEDING ELECTRONICS GROUP LIMITED	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Bicheng Electronic Technology Co., Ltd
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