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Buried Via PCB Built on 10 Layer with CNC Routing and Black Mask

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$9.99 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Enig
Base Material Copper Clad Laminate
Insulation Materials Epoxy Resin
Brand Bicheng
Transport Package Vacuum
Specification 101 X 100mm
Trademark Bicheng
Origin China

Product Description

General profile The buried via is the hole made between inner layers used to interconnect the inner layer signal. It can not be visible from surface layers of top and bottom layer. Generally, they're often used on the mobile phone, PDA board etc. Advantages A) Reduce the probability of ...

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Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Main Products RF PCB, High Frequency PCB, High Speed PCB, Low Loss PCB, Microwave PCB, Hybrid PCB, ...
Address 1716, Shiyuan Zhongxin, Xingyi Road, Fuyong Street, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Number of Foreign Trading Staff 6
Supply Chain Partners 12
Minimum Order Quantity 1 PCS

Prototype Comparison

	Buried Via PCB Built on 10 Layer with CNC Routing and Black Mask Contact Now	Quick View High Quality Multilayer PCB for Advanced Electronics Projects Contact Now	Quick View High-Reliability Multilayer PCB Designed for Complex Electronic Devices Contact Now	Quick View Robust Multilayer PCB with Superior Heat Resistance and Durability Contact Now	PCB PCBA Smart Electronics Multiply Layers Circuit Board PCB Assembly SMT/DIP/SMD PCBA Service Contact Now

Transaction Info
	Buried Via PCB Built on 10 Layer with CNC Routing and Black Mask Contact Now	Quick View High Quality Multilayer PCB for Advanced Electronics Projects Contact Now	Quick View High-Reliability Multilayer PCB Designed for Complex Electronic Devices Contact Now	Quick View Robust Multilayer PCB with Superior Heat Resistance and Durability Contact Now	PCB PCBA Smart Electronics Multiply Layers Circuit Board PCB Assembly SMT/DIP/SMD PCBA Service Contact Now
Price	US$9.99 / Piece	US$0.10-10.00 / Square Meter	US$0.10-10.00 / Square Meter	US$0.11-10.00 / Square Meter	US$2.00-8.00 / Piece
Min Order	1 Piece	1 Square Meter	1 Square Meter	1 Square Meter	2 Pieces
Payment Terms	Small-amount payment, Western Union, PayPal, D/P, T/T, LC	T/T, LC, D/P, PayPal, Western Union, Small-amount payment	T/T, LC, D/P, PayPal, Western Union, Small-amount payment	T/T, LC, D/P, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	East Asia(Japan/ South Korea), Domestic	East Asia(Japan/ South Korea), Domestic	East Asia(Japan/ South Korea), Domestic	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Enig; Base Material: Copper Clad Laminate; Insulation Materials: Epoxy Resin; Brand: Bicheng;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: CEM-3; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: New Chip; Soldermask Color: Green, Yellow, Blue, Black, White...; Sample: Available; OEM/ODM: Available; Certificate Gurantee: Yes; Test: 100%E-Testing; Color of Silk Screen: Green, Purple, Black; Service: OEM / Dfm;
Supplier Name	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Hemeilin Technology Co., Ltd.	Shenzhen Hemeilin Technology Co., Ltd.	Shenzhen Hemeilin Technology Co., Ltd.	Shenzhen New Chip international Ltd
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