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SMT Pick Placement Machine

US$82,500.00 / Piece

High-Speed Intelligent Placement Juki Machine Rx-8 pictures & photos

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How to Use High-Speed Intelligent Placement Juki Machine Rx-8

Name: High-Speed Intelligent Placement Juki Machine Rx-8
Uploaded: 2026-01-05T07:31:05+08:00
Description: Product Description JUKI Fast Smart Modular Chip Mountier SMT Pick and Place Machine Rx-8 Supply Juki Used Fast Smart Modular chip Mountier SMT High Speed Pick and Place Machine High-Speed Com

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$82,500.00 / Piece

Sepcifications

After-sales Service Support
Condition New
Speed High Speed
Precision High Precision
Certification CE
Warranty 12 Months
Automatic Grade Automatic
Type High-speed Chip Mounter
Transport Package Wooden Box
Specification 998mm x1893mm x 1530mm
Trademark Trademark
Origin Japan
Mounting Speed Component Size
High-Speed Loading 100,000cph
Component Height 3mm
Component Dimensions 0202~5mm

Product Description

Product Description JUKI Fast Smart Modular Chip Mountier SMT Pick and Place Machine Rx-8 Supply Juki Used Fast Smart Modular chip Mountier SMT High Speed Pick and Place Machine High-Speed Compact Modular MounterRX-8 Highest placement rates per square meter (sg foot)Achieves ...

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Shenzhen BOYU Electronic Technology Co., Ltd

Gold Member Since 2025

Audited Supplier

Business Type Trading Company
Main Products SMT Aoi Machine, SMT Spi Machine, SMT Printer Machine, SMT Juki Machine
Year of Establishment 2016-05-24
Number of Employees 20
Address Room 2202, South Side, Jinhao Building, No. 109, Fuyong Section, Guangshen Road, Fenghuang Community, Fuyong Sub-district, Bao 'an District, Shenzhen City

SMT Pick Placement Machine Comparison

	High-Speed Intelligent Placement Juki Machine Rx-8 Contact Now	Quick View Semiconductor Packaging Equipment Package Bonder for Tcb Ncp/Ncf/Tc-Cuf C2 and C4 and Fo-Wlp Chip-to-Substrate Bonding Contact Now	Quick View Advanced High-Speed Automatic Wafer Die Bonder for Precision Assembly Contact Now	Quick View High-Precision Linear Die Bonder for Superior Bonding Efficiency Contact Now	Quick View Advanced Integrated Solidifying Machine for Multi-Functional Die Bonding Contact Now

Transaction Info
	High-Speed Intelligent Placement Juki Machine Rx-8 Contact Now	Quick View Semiconductor Packaging Equipment Package Bonder for Tcb Ncp/Ncf/Tc-Cuf C2 and C4 and Fo-Wlp Chip-to-Substrate Bonding Contact Now	Quick View Advanced High-Speed Automatic Wafer Die Bonder for Precision Assembly Contact Now	Quick View High-Precision Linear Die Bonder for Superior Bonding Efficiency Contact Now	Quick View Advanced Integrated Solidifying Machine for Multi-Functional Die Bonding Contact Now
Price	US$82,500.00 / Piece	US$100,000.00-1,000,000.00 / Piece	US$100,000.00-1,000,000.00 / Piece	US$100,000.00-1,000,000.00 / Piece	US$100,000.00-1,000,000.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, D/P, PayPal, Western Union, LC	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Product Certification	CE	ISO	ISO	ISO	ISO
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Europe	Europe	Europe	Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months	Peak Season Lead Time: 3-6 months Off Season Lead Time: 1-3 months
Product Attributes
Specification	After-sales Service: Support; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Mounting Speed: Component Size; High-Speed Loading: 100,000cph; Component Height: 3mm; Component Dimensions: 0202~5mm;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: Ultra High-speed Chip Mounter; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;	After-sales Service: Provided; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Product Name: Semiconductor Equipment; Feature 1: Guaranteed Quality; Feature 2: Customized According to Needs; After-Sale Service: Provided;
Supplier Name	Shenzhen BOYU Electronic Technology Co., Ltd	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.	Jiangsu Himalaya Semiconductor Co., Ltd.
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