Multilayer PCB

US$0.90-99.99 / PCS

Recommend for you
What is 4-Layer Multilayer FPC PCB – Flexible Printed Circuit Board with 94V0
What is Rt/Duroid 6006 PCB - Advanced Circuit Board Manufacturing
What is Diclad 880 PTFE PCB Board for High-Frequency Electronics

What is 2.7mm 4-Layer Rogers RO3010 PCB Circuit of Shenzhen Multi-Layer PCB

Name: 2.7mm 4-Layer Rogers RO3010 PCB Circuit of Shenzhen Multi-Layer PCB
Uploaded: 2026-01-05T07:34:09+08:00
Description: 2.7mm 4-Layer Rogers RO3010 PCB with - High-Maturity for Automotive Radar & Satellite Antennas (All PCBs are custom-manufactured. Reference images and parameters may vary based on your design require

Contact Now

Get Latest Price

About this Item

Price

Purchase Qty. Reference FOB Price

1-99 PCS US$99.99

100+ PCS US$0.90

Sepcifications

Type Rigid Circuit Board
Dielectric RO3010
Material Ceramic-Filled PTFE Composites
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Brand Rogers
Transport Package Kk Paper, 3-Layer Wrinkle
Specification 35mm x 42mm per piece (± 0.15mm)
Trademark Bicheng
Origin Shenzhen China
Surface Finish Immersion Tin
Layer Count 4 Layers
Solder Mask None
Silkscreen None

Product Description

2.7mm 4-Layer Rogers RO3010 PCB with - High-Maturity for Automotive Radar &Satellite Antennas (All PCBs are custom-manufactured. Reference images and parameters may vary based on your design requirements.) 1. Overview of This 2.7mm Thick 4-Layer Rigid PCB This 2.7mm thick 4-layer Rogers ...

Learn More

Shenzhen Bicheng Electronic Technology Co., Ltd

Gold Member Since 2017

Audited Supplier

Main Products RF PCB, High Frequency PCB, High Speed PCB, Low Loss PCB, Microwave PCB, Hybrid PCB, ...
Address 1716, Shiyuan Zhongxin, Xingyi Road, Fuyong Street, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia
Number of Foreign Trading Staff 6
Supply Chain Partners 12
Minimum Order Quantity 1 PCS

Multilayer PCB Comparison

	2.7mm 4-Layer Rogers RO3010 PCB Circuit of Shenzhen Multi-Layer PCB Contact Now	Quick View Multilayer PCBA Contract Manufacturing Printed Circuit Board Assembly for Bluetooth Speaker Contact Now	Quick View Trusted Valued PCBA Factory PCB Assembly with ISO9001 ISO13485 IATF16949 Certificate Contact Now	Quick View Quick - Turn Manufacturing PCB Assembly IoT - Enabled PCBA for Connected Devices Contact Now	Quick View Medical - Grade PCBA Printed Circuit Board PCB Assembly with Precision Components Contact Now

Transaction Info
	2.7mm 4-Layer Rogers RO3010 PCB Circuit of Shenzhen Multi-Layer PCB Contact Now	Quick View Multilayer PCBA Contract Manufacturing Printed Circuit Board Assembly for Bluetooth Speaker Contact Now	Quick View Trusted Valued PCBA Factory PCB Assembly with ISO9001 ISO13485 IATF16949 Certificate Contact Now	Quick View Quick - Turn Manufacturing PCB Assembly IoT - Enabled PCBA for Connected Devices Contact Now	Quick View Medical - Grade PCBA Printed Circuit Board PCB Assembly with Precision Components Contact Now
Price	US$0.90-99.99 / PCS	US$0.15-10.00 / Piece	US$0.87-5.00 / Piece	US$0.15-4.80 / Piece	US$1.28-6.00 / Piece
Min Order	1 PCS	10 Pieces	10 Pieces	10 Pieces	5 Pieces
Payment Terms	Small-amount payment, Western Union, PayPal, D/P, T/T, LC	T/T	T/T	T/T	T/T
Quality Control
Product Certification	-	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO
Management System Certification	-	ISO9001:2015	ISO9001:2015	ISO9001:2015	ISO9001:2015
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia	Domestic	Domestic	Domestic	Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: RO3010; Material: Ceramic-Filled PTFE Composites; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Rogers; Surface Finish: Immersion Tin; Layer Count: 4 Layers; Solder Mask: None; Silkscreen: None;	Type: Flexible Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Fexible; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Type: Customized; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Customized; Processing Technology: Customized; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM/ODM; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;
Supplier Name	Shenzhen Bicheng Electronic Technology Co., Ltd	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Hongzhou Smart Technology Co., Ltd.
Select All

Contact Now

Hot Search