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      PCB Assembly
      US$0.15-4.80 / Piece

      Quick - Turn Manufacturing PCB Assembly IoT - Enabled PCBA for Connected Devices Video

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      10 Pieces US$0.15-4.80 / Piece

      Sepcifications

      • Type Customized
      • Dielectric FR-4
      • Material Aluminum Covered Copper Foil Layer
      • Application Communication
      • Flame Retardant Properties V0
      • Mechanical Rigid Customized
      • Processing Technology Customized
      • Base Material Aluminum
      • Insulation Materials Epoxy Resin
      • Brand OEM/ODM
      • Transport Package Antistatic Package+Plastic Box and Carton Box
      • Specification Customized
      • Trademark Customized
      • Origin Shenzhen China
      • PCBA-Testing X-ray, Aoi
      • Processing Electrolytic Foil
      • SMT Capacity >2 Million Points/Day
      • DIP Capacity >100K Parts/Day
      • Certification RoHS, CCC, ISO
      • Min. Space of BGA +/- 0.3mm
      • Min.Pin Space of IC 0.3mm
      • Max.Precision of IC Assembly 0.03mm
      • Surface Finishing Lead-Free HASL
      • Number of Layers 4-10 Layer
      • Board Thickness 1.6mm

      Product Description

      Quick - turn manufacturing PCB Assembly IoT - Enabled PCBA for Connected Devices Company Profile Shenzhen Hongzhou Technology Co, Limited was founded in 2005,we are a manufacturer who are specialized in PCB Assembly (SMT, DIP, AI) and electronic product final assembly (EMS) in the top market for ...

      Learn More

      PCB Assembly Comparison
      Transaction Info
      Price US$0.15-4.80 / Piece US$0.50-1.00 / Piece US$0.50-1.00 / Piece US$0.50-1.00 / Piece US$1.00-10.00 / Piece
      Min Order 10 Pieces 10 Pieces 10 Pieces 10 Pieces 1 Piece
      Payment Terms T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment
      Quality Control
      Product Certification RoHS, CCC, ISO - - - -
      Management System Certification ISO9001:2015 - - - -
      Trade Capacity
      Export Markets Domestic North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) Southeast Asia/ Mideast
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - Own Brand
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Customized;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Customized;
      Processing Technology: Customized;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Brand: OEM/ODM;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Aerospace;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: Mustar;
      D/C: Standard;
      Condition: New Original;
      Warranty: 2 Years;
      Mountng Type: SMT ,DIP;
      Memory Type: Standard;
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Aerospace;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: Mustar;
      D/C: Standard;
      Condition: New Original;
      Warranty: 2 Years;
      Mountng Type: SMT ,DIP;
      Memory Type: Standard;
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Aerospace;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: Mustar;
      D/C: Standard;
      Condition: New Original;
      Warranty: 2 Years;
      Mountng Type: SMT ,DIP;
      Memory Type: Standard;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Gold Plating Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Cry;
      Assembly Type: Fr4, FPC, Rigid-Flex PCB, Metal Base PCB;
      Supplier Name

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Chengruyuan Technology Co., Ltd.

      Diamond Member Audited Supplier

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