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      PCB Board
      US$0.10-100.00 / Piece
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      What is Gold Finger PCB Circuit Board with High Quality

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.10-100.00 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Kb
      • Insulation Materials Epoxy Resin
      • Brand Abis
      • Transport Package Vacuum Packing
      • Specification Custom
      • Trademark Abis Circuits
      • Origin Shenzhen, China
      • Certification UL,ISO9001&ISO14001,SGS,RoHS Report
      • Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
      • Board Thickness 0.2-6mm
      • Copper Thickness 0.5-8oz
      • Layers 1-20layers

      Product Description

      OEM/ODM Design Gold Finger PCB Board ABIS CIRCUITS CO., LTD is a professional PCB Board manufacturing which is focus on double side, Multilayer and HDI pcb board mass production. The company was established on 2006, We have two factories together ,The factory in Shenzhen is specialized in small ...

      Learn More

      PCB Board Comparison
      Transaction Info
      Price US$0.10-100.00 / Piece US$10.00-15.00 / Piece US$0.11-9.90 / Square Meter US$0.10 / Square Meter US$0.11-9.90 / Square Meter
      Min Order 1 Piece 1 Piece 1 Square Meter 1 Square Meter 1 Square Meter
      Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, LC, D/P, PayPal, Western Union, Small-amount payment T/T, LC, D/P, PayPal, Western Union, Small-amount payment T/T, LC, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification UL,ISO9001&ISO14001,SGS,RoHS Report ISO9001, ISO16949, RoHS - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic East Asia(Japan/ South Korea), Domestic East Asia(Japan/ South Korea), Domestic East Asia(Japan/ South Korea), Domestic
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Kb;
      Insulation Materials: Epoxy Resin;
      Brand: Abis;
      Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole;
      Board Thickness: 0.2-6mm;
      Copper Thickness: 0.5-8oz;
      Layers: 1-20layers;
      Type: Flexible Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V1;
      Mechanical Rigid: Fexible;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Metal Composite Materials;
      Brand: Xtl;
      Copper Thickness: H/H0z-5/50z;
      Board Thickness: 0.3mm - 3.2mm;
      Surface Finishing: OSP,Immersion Gold,Immersion Tin,Immersion AG;
      Maximum Layer: 12;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Aerospace;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: Hemeil;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Aerospace;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: Hemeil;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Aerospace;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: Hemeil;
      Supplier Name

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Jian Unice Pcb Technique Co., Ltd

      Gold Member Audited Supplier

      Shenzhen Hemeilin Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Hemeilin Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Hemeilin Technology Co., Ltd.

      Gold Member Audited Supplier

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