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Immersiongold 6 Layer HDI PCB 94V0 RoHS PCB Assembly Board OEM Multilayer Board Circuit Board pictures & photos

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What is Immersiongold 6 Layer HDI PCB 94V0 RoHS PCB Assembly Board OEM Multilayer Board Circuit Board

Name: Immersiongold 6 Layer HDI PCB 94V0 RoHS PCB Assembly Board OEM Multilayer Board Circuit Board
Uploaded: 2025-12-20T17:34:29+08:00
Description: ImmersionGold 6 Layer HDI PCB 94V0 RoHS PCB Assembly Board OEM Multilayer Board Circuit Board ABIS CIRCUITS CO., LTD is a professional PCB company which is focus on double side, Multilayer and HDI

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About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.10-10.00 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Kb
Insulation Materials Epoxy Resin
Brand Abis
Transport Package Vacuum Packing
Specification Custom
Trademark Abis Circuits
Origin Shenzhen, China
Certification UL,ISO9001&ISO14001,SGS,RoHS Report
Holes Specification Buried/Blind Vias, Via in Pads, Counter Sink Hole
Board Thickness 0.2-6mm
Copper Thickness 0.5-8oz
Layers 1-20 Layers
Enig Thickness 1-3u''
Hard Gold Thickness 5-50u''

Product Description

ImmersionGold 6 Layer HDI PCB 94V0 RoHS PCB Assembly Board OEM Multilayer Board Circuit Board ABIS CIRCUITS CO., LTD is a professional PCB company which is focus on double side, Multilayer and HDI pcb mass production. The company was established in 2006, We have two factories together (audited ...

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Abis Circuits Co., Ltd.

Diamond Member Since 2017

Audited Supplier

Rating & Reviews: 3.0/5.0

(1 Reviews)

Main Products Yes
Address Room 4113-4116, a Building, Hangcheng Intelligence Security Technology Park, Baoan District, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CFR, CIF, DAP, FCA
Terms of Payment LC, T/T, PayPal, Western Union
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

	Immersiongold 6 Layer HDI PCB 94V0 RoHS PCB Assembly Board OEM Multilayer Board Circuit Board Contact Now	Quick View OEM Electronic Manufacturer Schematic Design and Layout Services Other PCB & PCBA Contact Now	Quick View PCBA Design Prototype of Manufacture Contact Now	Quick View Custom 4 Layer Flex Rigid & Flexible PCB Cable Manufacture Fr4 PCBA Manufacturer Contact Now	Quick View Electronic OEM PCB&PCBA Assembly Manufacturer and PCBA, PCB Assembly Manufacturing Contact Now

Transaction Info
	Immersiongold 6 Layer HDI PCB 94V0 RoHS PCB Assembly Board OEM Multilayer Board Circuit Board Contact Now	Quick View OEM Electronic Manufacturer Schematic Design and Layout Services Other PCB & PCBA Contact Now	Quick View PCBA Design Prototype of Manufacture Contact Now	Quick View Custom 4 Layer Flex Rigid & Flexible PCB Cable Manufacture Fr4 PCBA Manufacturer Contact Now	Quick View Electronic OEM PCB&PCBA Assembly Manufacturer and PCBA, PCB Assembly Manufacturing Contact Now
Price	US$0.10-10.00 / Piece	US$1.50-6.00 / Piece	US$1.50-6.00 / Piece	US$1.50-6.00 / Piece	US$1.50-6.00 / Piece
Min Order	1 Piece	10 Pieces	10 Pieces	10 Pieces	10 Pieces
Payment Terms	LC, T/T, PayPal, Western Union	LC, D/P, T/T, PayPal, Western Union, Small-amount payment	LC, D/P, T/T, PayPal, Western Union, Small-amount payment	LC, D/P, T/T, PayPal, Western Union, Small-amount payment	LC, D/P, T/T, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	UL,ISO9001&ISO14001,SGS,RoHS Report	-	-	-	-
Management System Certification	-	ISO9001:2015	ISO9001:2015	ISO9001:2015	ISO9001:2015
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Europe, East Asia(Japan/ South Korea), Australia, Domestic, Sout Asia	North America, Europe, East Asia(Japan/ South Korea), Australia, Domestic, Sout Asia	North America, Europe, East Asia(Japan/ South Korea), Australia, Domestic, Sout Asia	North America, Europe, East Asia(Japan/ South Korea), Australia, Domestic, Sout Asia
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM	ODM	ODM	ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Board Thickness: 0.2-6mm; Copper Thickness: 0.5-8oz; Layers: 1-20 Layers; Enig Thickness: 1-3u''; Hard Gold Thickness: 5-50u'';	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM; Copper Thickness: 1/2oz 1oz 2oz 3oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Width: 0.075mm; Surface Finishing: HASL/OSP/Enig;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM; Copper Thickness: 1/2oz 1oz 2oz 3oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Width: 0.075mm; Surface Finishing: HASL/OSP/Enig;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM; Copper Thickness: 1/2oz 1oz 2oz 3oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Width: 0.075mm; Surface Finishing: HASL/OSP/Enig;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM; Copper Thickness: 1/2oz 1oz 2oz 3oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Width: 0.075mm; Surface Finishing: HASL/OSP/Enig;
Supplier Name	Abis Circuits Co., Ltd.	Dongguan Access Star Co., Ltd.	Dongguan Access Star Co., Ltd.	Dongguan Access Star Co., Ltd.	Dongguan Access Star Co., Ltd.
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