What is PCBA Design Prototype of Manufacture

Name: PCBA Design Prototype of Manufacture
Uploaded: 2026-02-20T20:14:48+08:00
Description: PCB /PCBA design,bom gerber files multilayer PCB,prototype PCB As below specification for reference: Item Process Capability Layer Counts 1-24L Material FR-4, Ceramic, Alu Base ,Cu base. Rogers etc M

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Price

Purchase Qty. Reference FOB Price

10-49 Pieces US$6.00

50-199 Pieces US$4.00

200-499 Pieces US$3.00

500-999 Pieces US$2.50

1,000+ Pieces US$1.50

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Aluminum Covered Copper Foil Layer
Application Consumer Electronics
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Epoxy Resin
Brand OEM
Transport Package Carton
Specification 10 X 10 CM
Trademark OEM
Origin China
Copper Thickness 1/2oz 1oz 2oz 3oz
Board Thickness 1.6mm
Min. Hole Size 0.25mm
Min. Line Width 0.075mm
Surface Finishing HASL/OSP/Enig

Product Description

PCB /PCBA design,bom gerber files multilayer PCB,prototype PCB As below specification for reference: Item Process Capability Layer Counts 1-24L Material FR-4, Ceramic, Alu Base ,Cu base. Rogers etc Maximum Size 600mm X 1500mm Board Outline Tolerance ±0.10mm Board Thickness ...

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Dongguan Access Star Co., Ltd.

Gold Member Since 2019

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Wire Harness, Cable Assembly, PCB A, Box Build, Consumer Electronic Products
Management System Certification ISO9001:2015
Product Certification UL
Inspection Type for Finished Products 100% inspection(Visual inspection & Function inspection)
ODM Service Available Yes

Circuit Board Comparison

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Transaction Info
	PCBA Design Prototype of Manufacture Contact Now	Quick View RF Transmitter Circuit Board Microwave Wireless Antenna High-Frequency Radio Frequency PCB Contact Now	Quick View Advanced PCB Stackup Technology Complex Multilayer Circuit Board Impedance Control 12-Layer PCB Contact Now	Quick View Multilayer High-Speed PCB Design Miniaturized Signal Integrity High-Density Interconnect HDI PCB Contact Now	Quick View Miniaturized Electronics High-Tech Circuit Board High-Speed Digital Custom Multilayer PCB Contact Now
Price	US$1.50-6.00 / Piece	US$2.00-5.00 / Piece	US$2.00-5.00 / Piece	US$2.00-5.00 / Piece	US$2.00-5.00 / Piece
Min Order	10 Pieces	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, D/P, T/T, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, Western Union, Small-amount payment, PayPal	LC, T/T, D/P, Western Union, Small-amount payment, PayPal	LC, T/T, D/P, Western Union, Small-amount payment, PayPal	LC, T/T, D/P, Western Union, Small-amount payment, PayPal
Quality Control
Management System Certification	ISO9001:2015	-	-	-	-
Trade Capacity
Export Markets	North America, Europe, East Asia(Japan/ South Korea), Australia, Domestic, Sout Asia	Europe	Europe	Europe	Europe
Annual Export Revenue	-	59,508,592 RMB	59,508,592 RMB	59,508,592 RMB	59,508,592 RMB
Business Model	ODM	OEM	OEM	OEM	OEM
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Aluminum Covered Copper Foil Layer; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Epoxy Resin; Brand: OEM; Copper Thickness: 1/2oz 1oz 2oz 3oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Width: 0.075mm; Surface Finishing: HASL/OSP/Enig;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Finestpcb; Service: One-Step PCB Service; Solder Mask Color: Blue.Green.Red.Black.White; Layer: 1-40layers; Min BGA Ball Pitch: 0.4mm; Surface Finishing: HASL\OSP\Immersion Gold; HASL\OSP\Immersion Gold: Fr4/Rogers/Aluminum/High Tg; Copper Thickness: 0.5-5oz; Board Thickness: 1.6 ±0.1mm; Minimum Hole: Minimum; Minimum Width: 3/3mil; Minimum Line: 3/3mil; Product Name: OEM PCB PCBA Board Assembly;
Supplier Name	Dongguan Access Star Co., Ltd.	Finest Printed Circuit Board Ltd.	Finest Printed Circuit Board Ltd.	Finest Printed Circuit Board Ltd.	Finest Printed Circuit Board Ltd.
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