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US$1.01-2.09 / Piece

High-Density Multilayer PCB Assemblies Immersion Gold PCB Multi Layer Printed Circuit Board pictures & photos

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What is High-Density Multilayer PCB Assemblies Immersion Gold PCB Multi Layer Printed Circuit Board

Name: High-Density Multilayer PCB Assemblies Immersion Gold PCB Multi Layer Printed Circuit Board
Uploaded: 2025-12-21T09:51:27+08:00
Description: Production Ability For PCB Layer: 1-40 layer Surface: HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect. Copper thickness: 0.25 Oz -12 Oz Material: FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum

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About this Item

Price

Purchase Qty. Reference FOB Price

100-499 Pieces US$2.09

500+ Pieces US$1.01

Sepcifications

Metal Coating Tin
Mode of Production SMT
Layers Multilayer
Base Material FR-6
Certification RoHS, CCC, ISO
Customized Customized
Condition New
Transport Package Packed with ESD Protection in Carton
Specification Thousands Choice Depends on Customers' requirement
Trademark ZD
Origin China
PCBA-Testing X-ray, Aoi
Type Rigid Circuit Board
Processing Technology Electrolytic Foil
Insulation Materials Organic Resin
Flame Retardant Properties V0

Product Description

Production Ability For PCB Layer: 1-40 layer Surface: HASL/OSP/ENIG/ImmersionGold/Flash Gold/Gold finger ect. Copper thickness: 0.25 Oz -12 Oz Material: FR-4,Halogen free,High TG,Cem-3,PTFE,Aluminum BT,Rogers Board thickness 0.1 to 6.0mm(4 to 240mil) Minimum line width/space ...

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Shenzhen Zhendatech Co., Ltd.

Gold Member Since 2016

Audited Supplier

Rating & Reviews: 5.0/5.0

(1 Reviews)

Main Products PCBA/PCB Assembly, Cable/Wire Harness Assemb, Sheet Metal Fabrication, Kiosk Machine ...
Address 701# Tianyou Second Industrial Zone, 28# Xintang Road, Xintian Community, Fuyong Town, Baoan District, 518103, P. R. China, Shenzhen, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, CFR, CIF, FAS, DDP, DAP, CIP, FCA, EXW
Terms of Payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

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Transaction Info
	High-Density Multilayer PCB Assemblies Immersion Gold PCB Multi Layer Printed Circuit Board Contact Now	Quick View IATF16949 Certified PCB Main Board PCBA Assembly for Automobile Display / Truck Brake Control Contact Now	Quick View Custom Bill Acceptor Arcade Coin Slot Casino Machine PCB Main Board PCBA Assembling Contact Now	Quick View OEM/ ODM PCB Motherboard PCBA Circuit Board Assembly Bluetooth Amplifier Module Contact Now	Quick View Best-Selling Flexible Jeep 1991 Gauges Cluster Multilayer Making Printed Circuit Board Contact Now
Price	US$1.01-2.09 / Piece	US$1.00-50.00 / Piece	US$1.00-40.00 / Piece	US$1.00-10.00 / Piece	US$0.01-0.41 / Piece
Min Order	100 Pieces	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram	T/T	T/T	T/T	LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification	RoHS, CCC, ISO	RoHS, UL / ISO9001, ISO13485, IATF16949	RoHS, UL / ISO9001, ISO13485, IATF16949	RoHS, UL / ISO9001, ISO13485, IATF16949	ISO9001, ISO14000, Ts16949.UL.RoHS
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Metal Coating: Tin; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-6; Customized: Customized; Condition: New; PCBA-Testing: X-ray, Aoi; Type: Rigid Circuit Board; Processing Technology: Electrolytic Foil; Insulation Materials: Organic Resin; Flame Retardant Properties: V0;	Metal Coating: Copper; Mode of Production: SMT; Layers: 1~28 Layers; Base Material: FR-4; Customized: Customized; Condition: New; Basic Material: Fr-4; PCBA Testing: X-ray, Aoi Test, Function Test; PCBA Min. BGA Pitch: 0.3mm; Processing Technology: Electrolytic Foil; Other Service: ODM, OEM, Final Product Assembling; Insulation Materials: Organic Resin; Application: Consumer Electronics, Communications, Aerospace; PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; Basic Material: Fr-4; PCBA Testing: X-ray, Aoi Test, Function Test; PCBA Min. BGA Pitch: 0.2mm; Processing Technology: Electrolytic Foil; Other Service: ODM, OEM, Final Product Assembling; Insulation Materials: Organic Resin; Application: Consumer Electronics, Communications, Aerospace; PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;	Metal Coating: Tin; Mode of Production: SMT; Layers: 1~28 Layers; Base Material: FR-4; Customized: Customized; Condition: New; Basic Material: Fr-4; PCBA Testing: X-ray, Aoi Test, Function Test; PCBA Min. BGA Pitch: 0.2mm; Processing Technology: Electrolytic Foil; Other Service: ODM, OEM, Final Product Assembling; Insulation Materials: Organic Resin; Application: Consumer Electronics, Communications, Aerospace; PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg; Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG; Layer: 1-22 Layers; Service: Turnkey Assembly PCB Service; Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui; Copper Thickness: 1-10oz; Min. SMD Size: 01005; QA Inspection: Aoi, X-ray, Ict; Order Qty: No Limited; Controlling Range: -40c~125c; Solder Resist Color: Green;Red;Yellow;Black;White; Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask; Trade Mark: OEM, ODM; Surface Finish: Lead Free HASL;
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